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Title: The creep behavior of In-Ag eutectic solder joints

Abstract

The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems.

Authors:
; ;  [1]
  1. Lawrence Berkeley National Lab., CA (United States). Center for Advanced Materials|[Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Mineral Engineering
Publication Date:
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
316051
DOE Contract Number:  
AC03-76SF00098
Resource Type:
Journal Article
Resource Relation:
Journal Name: Journal of Electronic Materials; Journal Volume: 28; Journal Issue: 1; Other Information: PBD: Jan 1999
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; CREEP; INDIUM ALLOYS; SILVER ALLOYS; SOLDERED JOINTS; EUTECTICS; TEMPERATURE DEPENDENCE; DATA ANALYSIS

Citation Formats

Reynolds, H.L., Kang, S.H., and Morris, J.W. Jr. The creep behavior of In-Ag eutectic solder joints. United States: N. p., 1999. Web. doi:10.1007/s11664-999-0197-5.
Reynolds, H.L., Kang, S.H., & Morris, J.W. Jr. The creep behavior of In-Ag eutectic solder joints. United States. doi:10.1007/s11664-999-0197-5.
Reynolds, H.L., Kang, S.H., and Morris, J.W. Jr. Fri . "The creep behavior of In-Ag eutectic solder joints". United States. doi:10.1007/s11664-999-0197-5.
@article{osti_316051,
title = {The creep behavior of In-Ag eutectic solder joints},
author = {Reynolds, H.L. and Kang, S.H. and Morris, J.W. Jr.},
abstractNote = {The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems.},
doi = {10.1007/s11664-999-0197-5},
journal = {Journal of Electronic Materials},
number = 1,
volume = 28,
place = {United States},
year = {Fri Jan 01 00:00:00 EST 1999},
month = {Fri Jan 01 00:00:00 EST 1999}
}