The creep behavior of In-Ag eutectic solder joints
- Lawrence Berkeley National Lab., CA (United States). Center for Advanced Materials
The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems.
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 316051
- Journal Information:
- Journal of Electronic Materials, Vol. 28, Issue 1; Other Information: PBD: Jan 1999
- Country of Publication:
- United States
- Language:
- English
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