Near atomic scale studies of electronic structure at grain boundaries in Ni{sub 3}Al
- School of Applied and Engineering Physics, Cornell University, Ithaca, New York 14853 (United States)
Why does boron doping improve the room temperature ductility of polycrystalline Ni{sub 3}Al? Besides preventing environmental embrittlement, B changes the fracture mode from intergranular to transgranular, suggesting an increase in the cohesive strength of the grain boundaries. This change in bonding at the grain boundary has been measured using spatially resolved electron energy loss spectroscopy. The Ni {ital L}{sub 2,3} core edge, which is sensitive to the filling of the Ni {ital d} band, shows that only the B-rich regions of the grain boundary have a bonding similar to that of the bulk material. These changes suggest a simple model to describe the cohesion of the boundary. {copyright} {ital 1995 The American Physical Society.}
- DOE Contract Number:
- FG02-85ER45211; FG02-87ER45322
- OSTI ID:
- 277369
- Journal Information:
- Physical Review Letters, Vol. 75, Issue 26; Other Information: PBD: Dec 1995
- Country of Publication:
- United States
- Language:
- English
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