Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate
A method of evaluating integrity of adherence of a conductor bond to a substrate includes: (a) impinging a plurality of light sources onto a substrate; (b) detecting optical reflective signatures emanating from the substrate from the impinged light; (c) determining location of a selected conductor bond on the substrate from the detected reflective signatures; (d) determining a target site on the selected conductor bond from the detected reflective signatures; (e) optically imparting an elastic wave at the target site through the selected conductor bond and into the substrate; (f) optically detecting an elastic wave signature emanating from the substrate resulting from the optically imparting step; and (g) determining integrity of adherence of the selected conductor bond to the substrate from the detected elastic wave signature emanating from the substrate. A system is disclosed which is capable of conducting the method. 13 figs.
- Research Organization:
- EG & G Idaho Inc
- DOE Contract Number:
- AC07-76ID01570
- Assignee:
- Lockheed Idaho Technologies Co., Idaho Falls, ID (United States)
- Patent Number(s):
- US 5,535,006/A/
- Application Number:
- PAN: 8-250,078
- OSTI ID:
- 253871
- Resource Relation:
- Other Information: PBD: 9 Jul 1996
- Country of Publication:
- United States
- Language:
- English
Similar Records
TH-A-207B-00: Shear-Wave Imaging and a QIBA US Biomarker Update
TH-A-207B-01: Basics and Current Implementations of Ultrasound Imaging of Shear Wave Speed and Elasticity