A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces

Feng, Tianli; Zhou, Hao; Cheng, Zhe; Larkin, Leighann Sarah; Neupane, Mahesh R.

doi:10.1021/acsami.3c02507

A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces

Journal Article · 16 June 2023 · ACS Applied Materials and Interfaces

DOI:https://doi.org/10.1021/acsami.3c02507· OSTI ID:2424217

^[1]; ^[1]; Cheng, Zhe ^[2]; Larkin, Leighann Sarah ^[3]; Neupane, Mahesh R. ^[3]

Department of Mechanical Engineering, University of Utah, Salt Lake City, Utah 84112, United States
School of Integrated Circuits and Frontiers Science Center for Nano-optoelectronics, Peking University, Beijing 100871, China
Army Research Directorate (ARD), DEVCOM Army Research Laboratory, Adelphi, Maryland 20708, United States

Not provided.

Research Organization:: Idaho National Laboratory (INL), Idaho Falls, ID (United States)

Sponsoring Organization:: USDOE

DOE Contract Number:: AC07-05ID14517

OSTI ID:: 2424217

Journal Information:: ACS Applied Materials and Interfaces, Journal Name: ACS Applied Materials and Interfaces Journal Issue: 25 Vol. 15; ISSN 1944-8244

Publisher:: American Chemical Society (ACS)

Country of Publication:: United States

Language:: English

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