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High Performance SiC Power Module Based on Repackaging of Discrete SiC Devices

Journal Article · · IEEE Transactions on Power Electronics
 [1];  [1]
  1. Department of Electrical and Computer Engineering, University of Texas at Austin, Austin, TX, USA
+ Show Author Affiliations

Not provided.

Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). TransformerResilience and Advanced Components (TRAC) Program
Sponsoring Organization:
USDOE
DOE Contract Number:
AC05-00OR22725
OSTI ID:
2423957
Journal Information:
IEEE Transactions on Power Electronics, Journal Name: IEEE Transactions on Power Electronics Journal Issue: 8 Vol. 38; ISSN 0885-8993
Publisher:
IEEE
Country of Publication:
United States
Language:
English

References (10)

A Review of SiC Power Module Packaging: Layout, Material System and Integration journal September 2017
Design and Implementation of Integrated Common Mode Capacitors for SiC-JFET Inverters journal July 2014
Hardware Design of a 13.8-kV/3-MVA PV Plus Storage Solid-State Transformer (PVS-SST) journal August 2022
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues journal March 2020
1200 V/650 V/160 A SiC+Si IGBT 3L Hybrid T-Type NPC Power Module With Enhanced EMI Shielding journal December 2021
An ultra-fast SiC phase-leg module in modified hybrid packaging structure conference September 2014
Driver Integrated Online Rds-on Monitoring Method for SiC Power Converters conference October 2022
Turn-on Gate Resistor Optimization For Paralleled SiC MOSFETs conference March 2020
Review of Silicon Carbide Power Devices and Their Applications journal October 2017
A frequency-domain study on the effect of DC-link decoupling capacitors conference September 2013

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