Packaging of a 10-kV Double-Side Cooled Silicon Carbide Diode Module With Thin Substrates Coated by a Nonlinear Resistive Polymer-Nanoparticle Composite

Zhang, Zichen; Lu, Shengchang; Wang, Boyan; Zhang, Yuhao; Yun, Nick; Sung, Woongje; Ngo, Khai D.  T.; Lu, Guo-Quan

doi:10.1109/tpel.2022.3190303

Packaging of a 10-kV Double-Side Cooled Silicon Carbide Diode Module With Thin Substrates Coated by a Nonlinear Resistive Polymer-Nanoparticle Composite

Journal Article · 01 December 2022 · IEEE Transactions on Power Electronics

DOI:https://doi.org/10.1109/tpel.2022.3190303· OSTI ID:2422281

^[1]; ^[2]; ^[2]; ^[2]; Yun, Nick ^[3]; Sung, Woongje ^[3]; ^[2]; ^[4]

Bradley Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA, USA; OSTI
Bradley Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, VA, USA
College of Nanoscale Science and Engineering, State University of New York Polytechnic Institute, Albany, NY, USA
Department of Materials Science and Engineering, Virginia Tech, Blacksburg, VA, USA

Not provided.

Research Organization:: Virginia Polytechnic Inst. and State Univ. (Virginia Tech), Blacksburg, VA (United States)

Sponsoring Organization:: USDOE Advanced Research Projects Agency - Energy (ARPA-E)

DOE Contract Number:: AR0001008

OSTI ID:: 2422281

Journal Information:: IEEE Transactions on Power Electronics, Journal Name: IEEE Transactions on Power Electronics Journal Issue: 12 Vol. 37; ISSN 0885-8993

Publisher:: IEEE

Country of Publication:: United States

Language:: English

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