Fine-grained Ti-Cu microstructures by solid state thermal cycling

Saville, Alec I.; Hesmondhalgh, Oliver W.; Compton, Natalie A.; Thompson, Gabriel A.; Sanders, Michael; Klemm-Toole, Jonah; Clarke, Kester D.; Fraser, Hamish L.; Kaufman, Michael J.; Karma, Alain; Clarke, Amy J.

doi:10.1016/j.addma.2023.103747

Fine-grained Ti-Cu microstructures by solid state thermal cycling

Journal Article · 01 August 2023 · Additive Manufacturing

DOI:https://doi.org/10.1016/j.addma.2023.103747· OSTI ID:2421655

Saville, Alec I. ^[1]; Hesmondhalgh, Oliver W.; Compton, Natalie A.; Thompson, Gabriel A.; ; ; Clarke, Kester D.; Fraser, Hamish L.; Kaufman, Michael J.; Karma, Alain; Clarke, Amy J.

OSTI

Not provided.

Research Organization:: Colorado School of Mines, Golden, CO (United States)

Sponsoring Organization:: USDOE Office of Science (SC)

DOE Contract Number:: SC0020870

OSTI ID:: 2421655

Journal Information:: Additive Manufacturing, Journal Name: Additive Manufacturing Journal Issue: C Vol. 75; ISSN 2214-8604

Publisher:: Elsevier

Country of Publication:: United States

Language:: English

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