Module-Level Thermal Interface Material Degradation in HALT

Journal Article · 22 November 2022 · Journal of Electronic Packaging

DOI:https://doi.org/10.1115/1.4056030· OSTI ID:2418618

Tompkins, Joshua ^[1]; Garcia, Alicia Medina; Huitink, David; Liao, Haitao

---

1. OSTI

Abstract

In this study, thermal interface material (TIM) degradation is driven through highly accelerated life test (HALT) using temperature cycling with a prescribed vibrational acceleration for two commercially available materials having thermal conductivities of 6.0 and 8.5 W/m K. HALT specimens were prepared by applying TIM through a 4-mil stencil over AlSiC baseplates in the shape of those used in Wolfspeed CAS325M12HM2 power electronics modules. Baseplates were mounted onto aluminum carrier blocks with embedded thermocouples to characterize the thermal resistance across the baseplate and TIM layer. Thermal dissipation into the top of the baseplates was provided by a custom heating block, which mimics the size and placement of the die junctions in CAS325 modules, applying power loads of 200, 300, and 400 W. After initial characterization, samples were transferred to the HALT chamber with one set of samples exposed to temperature cycling only (TCO) and the other temperature cycling and vibration (TCV). Both sample sets were cycled between temperature extremes of −40 °C and 180 °C with vibrations applied at a peak acceleration of 3.21 Grms. After hundreds of cycles, samples were reevaluated to assess changes in thermal resistance to provide an accelerated measure of TIM degradation. This allows for reliability prediction of useful lifetime (illustrated in a solar inverter case study herein), as well as to provide a basis for developing an accelerated testing method to related temperature cycling to faster methods of degradation. Such techniques provide a means to develop maintenance schedules for power modules for ensuring sufficient thermal performance over the operating lifetime.

• Research Organization: Univ. of Arkansas, Fayetteville, AR (United States)
• Sponsoring Organization: USDOE Office of Energy Efficiency and Renewable Energy (EERE)
• DOE Contract Number: EE0008349
• OSTI ID: 2418618
• Journal Information: Journal of Electronic Packaging, Journal Name: Journal of Electronic Packaging Journal Issue: 1 Vol. 145; ISSN 1043-7398
• Publisher: ASME
• Country of Publication: United States
• Language: English

Related Subjects

Engineering