Forced Air-Cooling Thermal Design Methodology for High-Density, High-Frequency, and High-Power Planar Transformers in 1U Applications

Ngo, Minh; Cao, Yuliang; Dong, Dong; Burgos, Rolando; Nguyen, Khanh; Ismail, Agirman

doi:10.1109/jestpe.2022.3223849

Forced Air-Cooling Thermal Design Methodology for High-Density, High-Frequency, and High-Power Planar Transformers in 1U Applications

Journal Article · 01 April 2023 · IEEE Journal of Emerging and Selected Topics in Power Electronics

DOI:https://doi.org/10.1109/jestpe.2022.3223849· OSTI ID:2418495

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Center for Power Electronics Systems, Virginia Polytechnic Institute and State University, Blacksburg, VA, USA; OSTI
Department of Electrical and Computer Engineering, Center for Power Electronics Systems (CPES), Virginia Polytechnic Institute and State University, Blacksburg, VA, USA
Department of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA, USA
Lockheed Martin, Fort Worth, Tx, USA
Carrier Power Electronics Group, Bloomfield, CT, USA

Not provided.

Research Organization:: North Carolina State University, Raleigh, NC (United States)

Sponsoring Organization:: USDOE Office of Energy Efficiency and Renewable Energy (EERE)

DOE Contract Number:: EE0006521

OSTI ID:: 2418495

Journal Information:: IEEE Journal of Emerging and Selected Topics in Power Electronics, Journal Name: IEEE Journal of Emerging and Selected Topics in Power Electronics Journal Issue: 2 Vol. 11; ISSN 2168-6777

Publisher:: IEEE

Country of Publication:: United States

Language:: English

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