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Title: A General Strategy to Achieve Colossal Permittivity and Low Dielectric Loss Through Constructing Insulator/Semiconductor/Insulator Multilayer Structures

Journal Article · · Journal of Low Temperature Physics
; ;  [1];  [2]; ;  [3];  [2]
  1. Soochow University, College of Physics, Optoelectronics and Energy, Collaborative Innovation Center of Suzhou Nano Science and Technology, and Jiangsu Key Laboratory of Thin Films (China)
  2. The Hong Kong Polytechnic University, Department of Applied Physics (China)
  3. Australian National University, Research School of Chemistry (Australia)

In this work, we propose a route to realize high-performance colossal permittivity (CP) by creating multilayer structures of insulator/semiconductor/insulator. To prove the new concept, we made heavily reduced rutile TiO{sub 2} via annealing route in Ar/H{sub 2} atmosphere. Dielectric studies show that the maximum dielectric permittivity (~ 3.0 × 10{sup 4}) of our prepared samples is about 100 times higher than that (~ 300) of conventional TiO{sub 2}. The minimum dielectric loss is 0.03 (at 10{sup 4}–10{sup 5} Hz). Furthermore, CP is almost independent of the frequency (100–10{sup 6} Hz) and the temperature (20–350 K). We suggest that the colossal permittivity is attributed to the high carrier concentration of the inner TiO{sub 2} semiconductor, while the low dielectric loss is due to the presentation of the insulator layer on the surface of TiO{sub 2}. The method proposed here can be expanded to other material systems, such as semiconductor Si sandwiched by top and bottom insulator layers of Ga{sub 2}O{sub 3}.

OSTI ID:
22809996
Journal Information:
Journal of Low Temperature Physics, Vol. 192, Issue 5-6; Other Information: Copyright (c) 2018 Springer Science+Business Media, LLC, part of Springer Nature; http://www.springer-ny.com; Country of input: International Atomic Energy Agency (IAEA); ISSN 0022-2291
Country of Publication:
United States
Language:
English