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Title: Soldering mask laser removal from printed circuit boards aiming copper recycling

Abstract

Highlights: • Use of laser as a tool for recycling of electronic waste is proposed. • Laser stripping removes varnishes from circuit boards exposing the copper underneath allowing electrochemical copper recover. •Good removal is achieved with nanosecond pulsed irradiation at 1064 nm. • Waste generated by the process is mainly solid, macroscopic and easy to handle. - Abstract: Management of waste of electric and electronic equipment (WEEE) is a key issue for modern societies; furthermore, it contains valuable materials that can be recycled, especially in printed circuit boards (PCB), which have approximately one-third of their weight in copper. In this study we demonstrated the use of laser to strip the covering soldering mask on PCB’s, thus exposing the copper underneath so that extraction techniques may take place. Using a Q-Switched Nd:YAG laser operating at 1064 nm and 532 nm we tested the procedure under different energy conditions. The laser stripping of the soldering mask was achieved with satisfactory results by irradiation with 225 mJ at 1064 nm. However, when using similar parameters at 532 nm the process of the coating ejection was not promoted properly, leading to a faulty detachment. Infrared laser PCB stripping presents itself to be technically viablemore » and environmental friendly, since it uses no chemicals inputs, offering one more option to WEEE treatment and recycling.« less

Authors:
; ;
Publication Date:
OSTI Identifier:
22742143
Resource Type:
Journal Article
Journal Name:
Waste Management
Additional Journal Information:
Journal Volume: 68; Other Information: Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 0956-053X
Country of Publication:
United States
Language:
English
Subject:
12 MANAGEMENT OF RADIOACTIVE WASTES, AND NON-RADIOACTIVE WASTES FROM NUCLEAR FACILITIES; COPPER; ELECTRONIC EQUIPMENT; ELECTRONIC WASTES; NEODYMIUM LASERS; PRINTED CIRCUITS; PULSED IRRADIATION; RECYCLING; REMOVAL; RESPIRATORS; SOLDERING; TESTING; WASTE MANAGEMENT

Citation Formats

Raele, Marcus Paulo, E-mail: mpraele@ipen.br, De Pretto, Lucas Ramos, and Zezell, Denise Maria. Soldering mask laser removal from printed circuit boards aiming copper recycling. United States: N. p., 2017. Web. doi:10.1016/J.WASMAN.2017.07.019.
Raele, Marcus Paulo, E-mail: mpraele@ipen.br, De Pretto, Lucas Ramos, & Zezell, Denise Maria. Soldering mask laser removal from printed circuit boards aiming copper recycling. United States. doi:10.1016/J.WASMAN.2017.07.019.
Raele, Marcus Paulo, E-mail: mpraele@ipen.br, De Pretto, Lucas Ramos, and Zezell, Denise Maria. Sun . "Soldering mask laser removal from printed circuit boards aiming copper recycling". United States. doi:10.1016/J.WASMAN.2017.07.019.
@article{osti_22742143,
title = {Soldering mask laser removal from printed circuit boards aiming copper recycling},
author = {Raele, Marcus Paulo, E-mail: mpraele@ipen.br and De Pretto, Lucas Ramos and Zezell, Denise Maria},
abstractNote = {Highlights: • Use of laser as a tool for recycling of electronic waste is proposed. • Laser stripping removes varnishes from circuit boards exposing the copper underneath allowing electrochemical copper recover. •Good removal is achieved with nanosecond pulsed irradiation at 1064 nm. • Waste generated by the process is mainly solid, macroscopic and easy to handle. - Abstract: Management of waste of electric and electronic equipment (WEEE) is a key issue for modern societies; furthermore, it contains valuable materials that can be recycled, especially in printed circuit boards (PCB), which have approximately one-third of their weight in copper. In this study we demonstrated the use of laser to strip the covering soldering mask on PCB’s, thus exposing the copper underneath so that extraction techniques may take place. Using a Q-Switched Nd:YAG laser operating at 1064 nm and 532 nm we tested the procedure under different energy conditions. The laser stripping of the soldering mask was achieved with satisfactory results by irradiation with 225 mJ at 1064 nm. However, when using similar parameters at 532 nm the process of the coating ejection was not promoted properly, leading to a faulty detachment. Infrared laser PCB stripping presents itself to be technically viable and environmental friendly, since it uses no chemicals inputs, offering one more option to WEEE treatment and recycling.},
doi = {10.1016/J.WASMAN.2017.07.019},
journal = {Waste Management},
issn = {0956-053X},
number = ,
volume = 68,
place = {United States},
year = {2017},
month = {10}
}