Estimation of water diffusion coefficient into polycarbonate at different temperatures using numerical simulation

Journal Article · Wed Jun 08 00:00:00 EDT 2016 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.4951801· OSTI ID:22608943

Nasirabadi, P. Shojaee; Jabbari, M.; Hattel, J. H. ^[1]

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1. Process Modelling Group, Department of Mechanical Engineering, Technical University of Denmark, Nils Koppels Allé, 2800 Kgs. Lyngby (Denmark)

Nowadays, many electronic systems are exposed to harsh conditions of relative humidity and temperature. Mass transport properties of electronic packaging materials are needed in order to investigate the influence of moisture and temperature on reliability of electronic devices. Polycarbonate (PC) is widely used in the electronics industry. Thus, in this work the water diffusion coefficient into PC is investigated. Furthermore, numerical methods used for estimation of the diffusion coefficient and their assumptions are discussed. 1D and 3D numerical solutions are compared and based on this, it is shown how the estimated value can be different depending on the choice of dimensionality in the model.

• OSTI ID: 22608943
• Journal Information: AIP Conference Proceedings, Vol. 1738, Issue 1; Conference: ICNAAM 2015: International conference of numerical analysis and applied mathematics 2015, Rhodes (Greece), 22-28 Sep 2015; Other Information: (c) 2016 Author(s); Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
COMPARATIVE EVALUATIONS
COMPUTERIZED SIMULATION
DIFFUSION
ELECTRONIC EQUIPMENT
HUMIDITY
MASS
NUMERICAL SOLUTION
PACKAGING
POLYCARBONATES
RELIABILITY
WATER