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Title: Elements configuration of the open lead test circuit

Abstract

In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.

Authors:
 [1];  [2]
  1. Advanced course of Electronics, Information and Communication Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan)
  2. Department of Communication Network Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan)
Publication Date:
OSTI Identifier:
22608573
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 1733; Journal Issue: 1; Conference: IC-NET 2015: International conference on nano-electronic technology devices and materials 2015, Selangor (Malaysia), 27 Feb - 2 Mar 2015; Other Information: (c) 2016 Author(s); Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; 77 NANOSCIENCE AND NANOTECHNOLOGY; DENSITY; LOGIC CIRCUITS; NANOELECTRONICS; NANOSTRUCTURES; PITCHES; PRINTED CIRCUITS; REVIEWS

Citation Formats

Fukuzaki, Yumi, E-mail: 14514@sr.kagawa-nct.ac.jp, and Ono, Akira. Elements configuration of the open lead test circuit. United States: N. p., 2016. Web. doi:10.1063/1.4948820.
Fukuzaki, Yumi, E-mail: 14514@sr.kagawa-nct.ac.jp, & Ono, Akira. Elements configuration of the open lead test circuit. United States. doi:10.1063/1.4948820.
Fukuzaki, Yumi, E-mail: 14514@sr.kagawa-nct.ac.jp, and Ono, Akira. Wed . "Elements configuration of the open lead test circuit". United States. doi:10.1063/1.4948820.
@article{osti_22608573,
title = {Elements configuration of the open lead test circuit},
author = {Fukuzaki, Yumi, E-mail: 14514@sr.kagawa-nct.ac.jp and Ono, Akira},
abstractNote = {In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.},
doi = {10.1063/1.4948820},
journal = {AIP Conference Proceedings},
number = 1,
volume = 1733,
place = {United States},
year = {Wed Jul 06 00:00:00 EDT 2016},
month = {Wed Jul 06 00:00:00 EDT 2016}
}