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Title: Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board

Abstract

In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.

Authors:
 [1];  [2]
  1. Siberian Federal University, 660041, Krasnoyarsk (Russian Federation)
  2. Institute of Computational Modeling of Russian Academy of Sciences, 660036, Krasnoyarsk (Russian Federation)
Publication Date:
OSTI Identifier:
22608259
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 1759; Journal Issue: 1; Conference: ICAAM 2016: International conference on analysis and applied mathematics, Almaty (Kazakhstan), 7-10 Sep 2016; Other Information: (c) 2016 Author(s); Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
97 MATHEMATICAL METHODS AND COMPUTING; ACCURACY; ALGORITHMS; DATA ANALYSIS; EQUATIONS; MATHEMATICAL MODELS; MATHEMATICAL SOLUTIONS; PRINTED CIRCUITS; ROUGHNESS; SMOOTH MANIFOLDS; THERMAL CONDUCTIVITY; THIN FILMS

Citation Formats

Korneeva, Anna, and Shaydurov, Vladimir. Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board. United States: N. p., 2016. Web. doi:10.1063/1.4959662.
Korneeva, Anna, & Shaydurov, Vladimir. Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board. United States. doi:10.1063/1.4959662.
Korneeva, Anna, and Shaydurov, Vladimir. 2016. "Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board". United States. doi:10.1063/1.4959662.
@article{osti_22608259,
title = {Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board},
author = {Korneeva, Anna and Shaydurov, Vladimir},
abstractNote = {In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.},
doi = {10.1063/1.4959662},
journal = {AIP Conference Proceedings},
number = 1,
volume = 1759,
place = {United States},
year = 2016,
month = 8
}
  • Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Nimore » can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.« less
  • Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using thesemore » items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.« less
  • A major New England printed-circuit-board manufacturer has avoided land disposal of several metallic wastes for more than 15 years by recycling them offsite. For example, the company uses ammoniacal etchant to etch copper. Waste generated by this process is used by an offsite recycler to produce copper compounds for pressure-treated lumber and for use as a catalyst. Sodium persulfate and peroxide-sulfuric micro-etchants are used at the facility, generating a crude copper sulfate solution, and copper sulfate also is the basis for the company's electroplating process. Wastes from all of these processes are used by an offsite recycler to produce coppermore » compounds that are sold for use in wood treatment and as mining reagents. Finally, metal hydroxide sludge generated by the company's wastewater treatment system contains substantial amounts of copper, which is sent for refining at a copper smelter.« less
  • The objective of the present engineering waste minimization study for printed circuit board manufacture was to examine several different waste separation and recycling processes to assess the feasibility of achieving significant minimization in the usage of water an the generation of wastewater and hazardous wastes. Mass balances are applied to each unit operation, i.e., process bath, rinse system, and separation unit, to determine the effects of drag-out control, recycle ratio, multi-stage rinse, and rinse water flow rate on the operations of several alternative processes. These and other tactics for reducing waste and improving efficiency are quantitatively evaluated. The major wastemore » streams of the PC board manufacturing process are spent solvents, metal-containing wastewater (Ag, Au, Cu, Sn, Ni, Pb), and sludges.« less
  • A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolvedmore » Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.« less