Note: Evaluation of slurry particle size analyzers for chemical mechanical planarization process
- School of Mechanical Engineering, Sungkyunkwan University, Suwon 440-746 (Korea, Republic of)
- SKKU Advanced Institute of Nano Technology (SAINT), Sungkyunkwan University, Suwon 440-746 (Korea, Republic of)
In the chemical mechanical planarization (CMP) process, slurry particle size is important because large particles can cause defects. Hence, selection of an appropriate particle measuring system is necessary in the CMP process. In this study, a scanning mobility particle sizer (SMPS) and dynamic light scattering (DLS) were compared for particle size distribution (PSD) measurements. In addition, the actual particle size and shape were confirmed by transmission electron microscope (TEM) results. SMPS classifies the particle size according to the electrical mobility, and measures the particle concentration (single particle measurement). On the other hand, the DLS measures the particle size distribution by analyzing scattered light from multiple particles (multiple particle measurement). For the slurry particles selected for evaluation, it is observed that SMPS shows bi-modal particle sizes 30 nm and 80 nm, which closely matches with the TEM measurements, whereas DLS shows only single mode distribution in the range of 90 nm to 100 nm and showing incapability of measuring small particles. Hence, SMPS can be a better choice for the evaluation of CMP slurry particle size and concentration measurements.
- OSTI ID:
- 22597147
- Journal Information:
- Review of Scientific Instruments, Vol. 87, Issue 4; Other Information: (c) 2016 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0034-6748
- Country of Publication:
- United States
- Language:
- English
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