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Title: Injection molding of high precision optics for LED applications made of liquid silicone rubber

Abstract

Light Emitting Diodes (LED) conquer the growing global market of lighting technologies. Due to their advantages, they are increasingly used in consumer products, in lighting applications in the home and in the mobility sector as well as in industrial applications. Particularly, with regard to the increasing use of high-power LED (HP-LED) the materials in the surrounding area of the light emitting semiconductor chip are of utmost importance. While the materials behind the semiconductor chip are optimized for maximum heat dissipation, the materials currently used for the encapsulation of the semiconductor chip (primary optics) and the secondary optics encounter their limits due to the high temperatures. In addition certain amounts of blue UV radiation degrade the currently used materials such as epoxy resins or polyurethanes for primary optics. In the context of an ongoing joint research project with various partners from the industry, an innovative manufacturing method for high precision optics for LED applications made of liquid silicone rubber (LSR) is analyzed at the Institut of Plastics Processing (IKV), Aachen. The aim of this project is to utilize the material-specific advantages of high transparent LSR, especially the excellent high temperature resistance and the great freedom in design. Therefore, a high integratedmore » injection molding process is developed. For the production of combined LED primary and secondary optics a LED board is placed in an injection mold and overmolded with LSR. Due to the integrated process and the reduction of subcomponents like the secondary optics the economics of the production process can be improved significantly. Furthermore combined LED optics offer an improved effectiveness, because there are no losses of the light power at the transition of the primary and secondary optics.« less

Authors:
;  [1]
  1. Institute of Plastics Processing (IKV), RWTH Aachen University, Pontstraße 49, 52062 Aachen (Germany)
Publication Date:
OSTI Identifier:
22590834
Resource Type:
Journal Article
Journal Name:
AIP Conference Proceedings
Additional Journal Information:
Journal Volume: 1713; Journal Issue: 1; Conference: PPS-31: 31. international conference of the Polymer Processing Society, Jeju Island (Korea, Republic of), 7-11 Jun 2015; Other Information: (c) 2016 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 0094-243X
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; ENERGY LOSSES; EPOXIDES; HEAT TRANSFER; LIGHT EMITTING DIODES; LIQUIDS; MANUFACTURING; OPTICS; POLYURETHANES; RESINS; RUBBERS; SEMICONDUCTOR MATERIALS; SILICONES; THERMAL DIFFUSIVITY; THERMAL EFFLUENTS; ULTRAVIOLET RADIATION

Citation Formats

Hopmann, Christian, and Röbig, Malte. Injection molding of high precision optics for LED applications made of liquid silicone rubber. United States: N. p., 2016. Web. doi:10.1063/1.4942268.
Hopmann, Christian, & Röbig, Malte. Injection molding of high precision optics for LED applications made of liquid silicone rubber. United States. doi:10.1063/1.4942268.
Hopmann, Christian, and Röbig, Malte. Wed . "Injection molding of high precision optics for LED applications made of liquid silicone rubber". United States. doi:10.1063/1.4942268.
@article{osti_22590834,
title = {Injection molding of high precision optics for LED applications made of liquid silicone rubber},
author = {Hopmann, Christian and Röbig, Malte},
abstractNote = {Light Emitting Diodes (LED) conquer the growing global market of lighting technologies. Due to their advantages, they are increasingly used in consumer products, in lighting applications in the home and in the mobility sector as well as in industrial applications. Particularly, with regard to the increasing use of high-power LED (HP-LED) the materials in the surrounding area of the light emitting semiconductor chip are of utmost importance. While the materials behind the semiconductor chip are optimized for maximum heat dissipation, the materials currently used for the encapsulation of the semiconductor chip (primary optics) and the secondary optics encounter their limits due to the high temperatures. In addition certain amounts of blue UV radiation degrade the currently used materials such as epoxy resins or polyurethanes for primary optics. In the context of an ongoing joint research project with various partners from the industry, an innovative manufacturing method for high precision optics for LED applications made of liquid silicone rubber (LSR) is analyzed at the Institut of Plastics Processing (IKV), Aachen. The aim of this project is to utilize the material-specific advantages of high transparent LSR, especially the excellent high temperature resistance and the great freedom in design. Therefore, a high integrated injection molding process is developed. For the production of combined LED primary and secondary optics a LED board is placed in an injection mold and overmolded with LSR. Due to the integrated process and the reduction of subcomponents like the secondary optics the economics of the production process can be improved significantly. Furthermore combined LED optics offer an improved effectiveness, because there are no losses of the light power at the transition of the primary and secondary optics.},
doi = {10.1063/1.4942268},
journal = {AIP Conference Proceedings},
issn = {0094-243X},
number = 1,
volume = 1713,
place = {United States},
year = {2016},
month = {3}
}