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Title: High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings

Abstract

The increasing density of electronic devices underscores the need for efficient thermal management. Silver nanowires (AgNWs), as one-dimensional nanostructures, possess a high aspect ratio and intrinsic thermal conductivity. However, high electrical conductivity of AgNWs limits their application for electronic packaging. We synthesized boron nitride-coated silver nanowires (AgNWs@BN) using a flexible and fast method followed by incorporation into synthetic polyimide (PI) for enhanced thermal conductivity and dielectric properties of nanocomposites. The thinner boron nitride intermediate nanolayer on AgNWs not only alleviated the mismatch between AgNWs and PI but also enhanced their interfacial interaction. Hence, the maximum thermal conductivity of an AgNWs@BN/PI composite with a filler loading up to 20% volume was increased to 4.33 W/m K, which is an enhancement by nearly 23.3 times compared with that of the PI matrix. The relative permittivity and dielectric loss were about 9.89 and 0.015 at 1 MHz, respectively. Compared with AgNWs@SiO{sub 2}/PI and Ag@BN/PI composites, boron nitride-coated core-shell structures effectively increased the thermal conductivity and reduced the permittivity of nanocomposites. The relative mechanism was studied and discussed. This study enables the identification of appropriate modifier fillers for polymer matrix nanocomposites.

Authors:
;  [1]
  1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an Shaanxi 710072 (China)
Publication Date:
OSTI Identifier:
22590526
Resource Type:
Journal Article
Journal Name:
Applied Physics Letters
Additional Journal Information:
Journal Volume: 109; Journal Issue: 8; Other Information: (c) 2016 Author(s); Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 0003-6951
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; BORON NITRIDES; ELECTRIC CONDUCTIVITY; ELECTRONIC EQUIPMENT; MHZ RANGE; NANOCOMPOSITES; NANOWIRES; PERMITTIVITY; POLYMERS; SILICON OXIDES; SILVER; THERMAL CONDUCTIVITY

Citation Formats

Zhou, Yongcun, and Liu, Feng, E-mail: liufeng@nwpu.edu.cn. High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings. United States: N. p., 2016. Web. doi:10.1063/1.4961625.
Zhou, Yongcun, & Liu, Feng, E-mail: liufeng@nwpu.edu.cn. High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings. United States. doi:10.1063/1.4961625.
Zhou, Yongcun, and Liu, Feng, E-mail: liufeng@nwpu.edu.cn. Mon . "High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings". United States. doi:10.1063/1.4961625.
@article{osti_22590526,
title = {High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings},
author = {Zhou, Yongcun and Liu, Feng, E-mail: liufeng@nwpu.edu.cn},
abstractNote = {The increasing density of electronic devices underscores the need for efficient thermal management. Silver nanowires (AgNWs), as one-dimensional nanostructures, possess a high aspect ratio and intrinsic thermal conductivity. However, high electrical conductivity of AgNWs limits their application for electronic packaging. We synthesized boron nitride-coated silver nanowires (AgNWs@BN) using a flexible and fast method followed by incorporation into synthetic polyimide (PI) for enhanced thermal conductivity and dielectric properties of nanocomposites. The thinner boron nitride intermediate nanolayer on AgNWs not only alleviated the mismatch between AgNWs and PI but also enhanced their interfacial interaction. Hence, the maximum thermal conductivity of an AgNWs@BN/PI composite with a filler loading up to 20% volume was increased to 4.33 W/m K, which is an enhancement by nearly 23.3 times compared with that of the PI matrix. The relative permittivity and dielectric loss were about 9.89 and 0.015 at 1 MHz, respectively. Compared with AgNWs@SiO{sub 2}/PI and Ag@BN/PI composites, boron nitride-coated core-shell structures effectively increased the thermal conductivity and reduced the permittivity of nanocomposites. The relative mechanism was studied and discussed. This study enables the identification of appropriate modifier fillers for polymer matrix nanocomposites.},
doi = {10.1063/1.4961625},
journal = {Applied Physics Letters},
issn = {0003-6951},
number = 8,
volume = 109,
place = {United States},
year = {2016},
month = {8}
}