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Title: Limitations to laser machining of silicon using femtosecond micro-Bessel beams in the infrared

Abstract

We produce and characterize high-angle femtosecond Bessel beams at 1300-nm wavelength leading to nonlinearly ionized plasma micro-channels in both glass and silicon. With microjoule pulse energy, we demonstrate controlled through-modifications in 150-μm glass substrates. In silicon, strong two-photon absorption leads to larger damages at the front surface but also a clamping of the intensity inside the bulk at a level of ≈4 × 10{sup 11 }W cm{sup −2} which is below the threshold for volume and rear surface modification. We show that the intensity clamping is associated with a strong degradation of the Bessel-like profile. The observations highlight that the inherent limitation to ultrafast energy deposition inside semiconductors with Gaussian focusing [Mouskeftaras et al., Appl. Phys. Lett. 105, 191103 (2014)] applies also for high-angle Bessel beams.

Authors:
; ;  [1];  [2]
  1. Aix-Marseille University, CNRS, LP3 UMR 7341, F-13288 Marseille (France)
  2. Industrial and Manufacturing Systems Engineering, Kansas State University, Manhattan, Kansas 66506 (United States)
Publication Date:
OSTI Identifier:
22402861
Resource Type:
Journal Article
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Volume: 117; Journal Issue: 15; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 0021-8979
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; BESSEL FUNCTIONS; ENERGY ABSORPTION; ENERGY LOSSES; GLASS; INFRARED RADIATION; LASER BEAM MACHINING; MODIFICATIONS; NONLINEAR PROBLEMS; PHOTONS; SEMICONDUCTOR MATERIALS; SILICON; SUBSTRATES; SURFACES

Citation Formats

Grojo, David, Mouskeftaras, Alexandros, Delaporte, Philippe, and Lei, Shuting. Limitations to laser machining of silicon using femtosecond micro-Bessel beams in the infrared. United States: N. p., 2015. Web. doi:10.1063/1.4918669.
Grojo, David, Mouskeftaras, Alexandros, Delaporte, Philippe, & Lei, Shuting. Limitations to laser machining of silicon using femtosecond micro-Bessel beams in the infrared. United States. https://doi.org/10.1063/1.4918669
Grojo, David, Mouskeftaras, Alexandros, Delaporte, Philippe, and Lei, Shuting. 2015. "Limitations to laser machining of silicon using femtosecond micro-Bessel beams in the infrared". United States. https://doi.org/10.1063/1.4918669.
@article{osti_22402861,
title = {Limitations to laser machining of silicon using femtosecond micro-Bessel beams in the infrared},
author = {Grojo, David and Mouskeftaras, Alexandros and Delaporte, Philippe and Lei, Shuting},
abstractNote = {We produce and characterize high-angle femtosecond Bessel beams at 1300-nm wavelength leading to nonlinearly ionized plasma micro-channels in both glass and silicon. With microjoule pulse energy, we demonstrate controlled through-modifications in 150-μm glass substrates. In silicon, strong two-photon absorption leads to larger damages at the front surface but also a clamping of the intensity inside the bulk at a level of ≈4 × 10{sup 11 }W cm{sup −2} which is below the threshold for volume and rear surface modification. We show that the intensity clamping is associated with a strong degradation of the Bessel-like profile. The observations highlight that the inherent limitation to ultrafast energy deposition inside semiconductors with Gaussian focusing [Mouskeftaras et al., Appl. Phys. Lett. 105, 191103 (2014)] applies also for high-angle Bessel beams.},
doi = {10.1063/1.4918669},
url = {https://www.osti.gov/biblio/22402861}, journal = {Journal of Applied Physics},
issn = {0021-8979},
number = 15,
volume = 117,
place = {United States},
year = {Tue Apr 21 00:00:00 EDT 2015},
month = {Tue Apr 21 00:00:00 EDT 2015}
}