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Title: Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

Abstract

We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route having mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.

Authors:
; ; ;  [1];  [2]
  1. Department of Instrumentation and Applied Physics, Indian Institute of Science, Malleswaram, Bangalore 560012 (India)
  2. Vikram Sarabhai Space Center, Indian Space Research Organization, Trivandrum 695022 (India)
Publication Date:
OSTI Identifier:
22398781
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 106; Journal Issue: 12; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; ABUNDANCE; COMPUTERIZED SIMULATION; CONCENTRATION RATIO; EFFICIENCY; ELECTRIC CONDUCTIVITY; ELECTRIC FIELDS; FLUIDS; GEOMETRY; IMPEDANCE; PARTICLES; PRINTED CIRCUITS; REPAIR

Citation Formats

Nair, Aswathi, Raghunandan, Karthik, Yaswant, Vaddi, Sambandan, Sanjiv, E-mail: sanjiv@iap.iisc.ernet.in, E-mail: ssanjiv@isu.iisc.ernet.in, and Pillai, Sreelal S. Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards. United States: N. p., 2015. Web. doi:10.1063/1.4916513.
Nair, Aswathi, Raghunandan, Karthik, Yaswant, Vaddi, Sambandan, Sanjiv, E-mail: sanjiv@iap.iisc.ernet.in, E-mail: ssanjiv@isu.iisc.ernet.in, & Pillai, Sreelal S. Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards. United States. doi:10.1063/1.4916513.
Nair, Aswathi, Raghunandan, Karthik, Yaswant, Vaddi, Sambandan, Sanjiv, E-mail: sanjiv@iap.iisc.ernet.in, E-mail: ssanjiv@isu.iisc.ernet.in, and Pillai, Sreelal S. Mon . "Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards". United States. doi:10.1063/1.4916513.
@article{osti_22398781,
title = {Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards},
author = {Nair, Aswathi and Raghunandan, Karthik and Yaswant, Vaddi and Sambandan, Sanjiv, E-mail: sanjiv@iap.iisc.ernet.in, E-mail: ssanjiv@isu.iisc.ernet.in and Pillai, Sreelal S.},
abstractNote = {We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route having mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.},
doi = {10.1063/1.4916513},
journal = {Applied Physics Letters},
number = 12,
volume = 106,
place = {United States},
year = {Mon Mar 23 00:00:00 EDT 2015},
month = {Mon Mar 23 00:00:00 EDT 2015}
}