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Title: Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node

Abstract

Tungsten interconnects in silicon integrated circuits built at the 90 nm node with releasable configurations on silicon on insulator wafers serve as the basis for advanced forms of water-soluble electronics. These physically transient systems have potential uses in applications that range from temporary biomedical implants to zero-waste environmental sensors. Systematic experimental studies and modeling efforts reveal essential aspects of electrical performance in field effect transistors and complementary ring oscillators with as many as 499 stages. Accelerated tests reveal timescales for dissolution of the various constituent materials, including tungsten, silicon, and silicon dioxide. The results demonstrate that silicon complementary metal-oxide-semiconductor circuits formed with tungsten interconnects in foundry-compatible fabrication processes can serve as a path to high performance, mass-produced transient electronic systems.

Authors:
; ;  [1];  [2];  [3]
  1. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 104 S Goodwin Ave., Urbana, Illinois 61801 (United States)
  2. Lincoln Laboratory, Massachusetts Institute of Technology, 244 Wood Street, Lexington, Massachusetts 02420 (United States)
  3. Department of Biomedical Engineering, Department of Physics, Tufts University, 4 Colby St., Medford, Massachusetts 02155 (United States)
Publication Date:
OSTI Identifier:
22395686
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Physics Letters; Journal Volume: 106; Journal Issue: 1; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; COMPUTERIZED SIMULATION; FABRICATION; FIELD EFFECT TRANSISTORS; INTEGRATED CIRCUITS; OSCILLATORS; POTENTIALS; SEMICONDUCTOR MATERIALS; SENSORS; SILICON; SILICON OXIDES; TRANSIENTS; TUNGSTEN; WATER

Citation Formats

Yin, Lan, Harburg, Daniel V., Rogers, John A., E-mail: jrogers@illinois.edu, Bozler, Carl, and Omenetto, Fiorenzo. Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node. United States: N. p., 2015. Web. doi:10.1063/1.4905321.
Yin, Lan, Harburg, Daniel V., Rogers, John A., E-mail: jrogers@illinois.edu, Bozler, Carl, & Omenetto, Fiorenzo. Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node. United States. doi:10.1063/1.4905321.
Yin, Lan, Harburg, Daniel V., Rogers, John A., E-mail: jrogers@illinois.edu, Bozler, Carl, and Omenetto, Fiorenzo. Mon . "Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node". United States. doi:10.1063/1.4905321.
@article{osti_22395686,
title = {Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node},
author = {Yin, Lan and Harburg, Daniel V. and Rogers, John A., E-mail: jrogers@illinois.edu and Bozler, Carl and Omenetto, Fiorenzo},
abstractNote = {Tungsten interconnects in silicon integrated circuits built at the 90 nm node with releasable configurations on silicon on insulator wafers serve as the basis for advanced forms of water-soluble electronics. These physically transient systems have potential uses in applications that range from temporary biomedical implants to zero-waste environmental sensors. Systematic experimental studies and modeling efforts reveal essential aspects of electrical performance in field effect transistors and complementary ring oscillators with as many as 499 stages. Accelerated tests reveal timescales for dissolution of the various constituent materials, including tungsten, silicon, and silicon dioxide. The results demonstrate that silicon complementary metal-oxide-semiconductor circuits formed with tungsten interconnects in foundry-compatible fabrication processes can serve as a path to high performance, mass-produced transient electronic systems.},
doi = {10.1063/1.4905321},
journal = {Applied Physics Letters},
number = 1,
volume = 106,
place = {United States},
year = {Mon Jan 05 00:00:00 EST 2015},
month = {Mon Jan 05 00:00:00 EST 2015}
}
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