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Title: High power pulsed magnetron sputtering: A method to increase deposition rate

Abstract

High power pulsed magnetron sputtering (HPPMS) is a state-of-the-art physical vapor deposition technique with several industrial applications. One of the main disadvantages of this process is its low deposition rate. In this work, the authors report a new magnetic field configuration, which produces deposition rates twice that of conventional magnetron's dipole magnetic field configuration. Three different magnet pack configurations are discussed in this paper, and an optimized magnet pack configuration for HPPMS that leads to a higher deposition rate and nearly full-face target erosion is presented. The discussed magnetic field produced by a specially designed magnet assembly is of the same size as the conventional magnet assembly and requires no external fields. Comparison of deposition rates with different power supplies and the electron trapping efficiency in complex magnetic field arrangements are discussed.

Authors:
; ;  [1];  [2]
  1. Center for Plasma Material Interactions, University of Illinois, Urbana, Illinois 61801 (United States)
  2. Center for Plasma Material Interactions, University of Illinois, Urbana, Illinois 61801 and National Nuclear Research University MEPhI (Moscow Engineering Physics Institute), Moscow 115409 (Russian Federation)
Publication Date:
OSTI Identifier:
22392170
Resource Type:
Journal Article
Journal Name:
Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films
Additional Journal Information:
Journal Volume: 33; Journal Issue: 3; Other Information: (c) 2015 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 0734-2101
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; DESIGN; EFFICIENCY; EROSION; MAGNETIC FIELD CONFIGURATIONS; MAGNETIC FIELDS; MAGNETRONS; MAGNETS; PHYSICAL VAPOR DEPOSITION; POWER SUPPLIES; SPUTTERING

Citation Formats

Raman, Priya, E-mail: raman6@illinois.edu, McLain, Jake, Ruzic, David N, and Shchelkanov, Ivan A. High power pulsed magnetron sputtering: A method to increase deposition rate. United States: N. p., 2015. Web. doi:10.1116/1.4916108.
Raman, Priya, E-mail: raman6@illinois.edu, McLain, Jake, Ruzic, David N, & Shchelkanov, Ivan A. High power pulsed magnetron sputtering: A method to increase deposition rate. United States. doi:10.1116/1.4916108.
Raman, Priya, E-mail: raman6@illinois.edu, McLain, Jake, Ruzic, David N, and Shchelkanov, Ivan A. Fri . "High power pulsed magnetron sputtering: A method to increase deposition rate". United States. doi:10.1116/1.4916108.
@article{osti_22392170,
title = {High power pulsed magnetron sputtering: A method to increase deposition rate},
author = {Raman, Priya, E-mail: raman6@illinois.edu and McLain, Jake and Ruzic, David N and Shchelkanov, Ivan A.},
abstractNote = {High power pulsed magnetron sputtering (HPPMS) is a state-of-the-art physical vapor deposition technique with several industrial applications. One of the main disadvantages of this process is its low deposition rate. In this work, the authors report a new magnetic field configuration, which produces deposition rates twice that of conventional magnetron's dipole magnetic field configuration. Three different magnet pack configurations are discussed in this paper, and an optimized magnet pack configuration for HPPMS that leads to a higher deposition rate and nearly full-face target erosion is presented. The discussed magnetic field produced by a specially designed magnet assembly is of the same size as the conventional magnet assembly and requires no external fields. Comparison of deposition rates with different power supplies and the electron trapping efficiency in complex magnetic field arrangements are discussed.},
doi = {10.1116/1.4916108},
journal = {Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films},
issn = {0734-2101},
number = 3,
volume = 33,
place = {United States},
year = {2015},
month = {5}
}