Effect of postdeposition annealing on the electrical properties of β-Ga{sub 2}O{sub 3} thin films grown on p-Si by plasma-enhanced atomic layer deposition
- Faculty of Science, Department of Physics, Cankiri Karatekin University, Cankiri 18100 (Turkey)
- National Nanotechnology Research Center (UNAM), Bilkent University, Ankara 06800, Turkey and Institute of Materials Science and Nanotechnology, Bilkent University, Ankara 06800 (Turkey)
Ga{sub 2}O{sub 3} dielectric thin films were deposited on (111)-oriented p-type silicon wafers by plasma-enhanced atomic layer deposition using trimethylgallium and oxygen plasma. Structural analysis of the Ga{sub 2}O{sub 3} thin films was carried out using grazing-incidence x-ray diffraction. As-deposited films were amorphous. Upon postdeposition annealing at 700, 800, and 900 °C for 30 min under N{sub 2} ambient, films crystallized into β-form monoclinic structure. Electrical properties of the β-Ga{sub 2}O{sub 3} thin films were then investigated by fabricating and characterizing Al/β-Ga{sub 2}O{sub 3}/p-Si metal–oxide-semiconductor capacitors. The effect of postdeposition annealing on the leakage current densities, leakage current conduction mechanisms, dielectric constants, flat-band voltages, reverse breakdown voltages, threshold voltages, and effective oxide charges of the capacitors were presented. The effective oxide charges (Q{sub eff}) were calculated from the capacitance–voltage (C-V) curves using the flat-band voltage shift and were found as 2.6 × 10{sup 12}, 1.9 × 10{sup 12}, and 2.5 × 10{sup 12} cm{sup −2} for samples annealed at 700, 800, and 900 °C, respectively. Effective dielectric constants of the films decreased with increasing annealing temperature. This situation was attributed to the formation of an interfacial SiO{sub 2} layer during annealing process. Leakage mechanisms in the regions where current increases gradually with voltage were well fitted by the Schottky emission model for films annealed at 700 and 900 °C, and by the Frenkel–Poole emission model for film annealed at 800 °C. Leakage current density was found to improve with annealing temperature. β-Ga{sub 2}O{sub 3} thin film annealed at 800 °C exhibited the highest reverse breakdown field value.
- OSTI ID:
- 22318072
- Journal Information:
- Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films, Vol. 32, Issue 4; Other Information: (c) 2014 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA); ISSN 0734-2101
- Country of Publication:
- United States
- Language:
- English
Similar Records
Praseodymium silicate formed by postdeposition high-temperature annealing
Thermal behavior of the microstructure and the electrical properties of magnetron-sputtered high-k titanium silicate thin films