Electromigration induced Kirkendall void growth in Sn-3.5Ag/Cu solder joints
- Department of Materials Science and Engineering, Electronic Packaging Laboratory, KAIST, 373-1 Guseong-dong, Yuseong-gu, Daejeon 305-701 (Korea, Republic of)
Effects of electric current flow on the Kirkendall void formation at solder joints were investigated using Sn-3.5Ag/Cu joints specially designed to have localized nucleation of Kirkendall voids at the Cu{sub 3}Sn/Cu interface. Under the current density of 1 × 10{sup 4} A/cm{sup 2}, kinetics of Kirkendall void growth and intermetallic compound thickening were affected by the electromigration (EM), and both showed the polarity effect. Cu{sub 6}Sn{sub 5} showed a strong susceptibility to the polarity effect, while Cu{sub 3}Sn did not. The electromigration force induced additional tensile (or compressive) stress at the cathode (or anode), which accelerated (or decelerated) the void growth. From the measurements of the fraction of void at the Cu{sub 3}Sn/Cu interface on SEM micrographs and analysis of the kinetics of void growth, the magnitude of the local stress induced by EM was estimated to be 9 MPa at the anode and −7 MPa at the cathode.
- OSTI ID:
- 22277966
- Journal Information:
- Journal of Applied Physics, Vol. 115, Issue 8; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
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