High-cycle fatigue behavior of Ti-5Al-2.5Sn ELI alloy forging at low temperatures

Journal Article · Mon Jan 27 00:00:00 EST 2014 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.4860646· OSTI ID:22264048

Ono, Yoshinori; Yuri, Tetsumi; Ogata, Toshio; Demura, Masahiko ^[1]; Matsuoka, Saburo ^[2]; Sunakawa, Hideo ^[3]

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1. National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047 (Japan)
2. Kyushu University, 744, Motooka, Nishi-ku, Fukuoka, Fukuoka 819-0395 (Japan)
3. Japan Aerospace Exploration Agency, 2-1-1 Sengen, Tsukuba, Ibaraki 305-8505 (Japan)

High-cycle fatigue properties of Ti-5Al-2.5Sn Extra Low Interstitial (ELI) alloy forging were investigated at low temperatures. The high-cycle fatigue strength at low temperatures of this alloy was relatively low compared with that at ambient temperature. The crystallographic orientation of a facet formed at a fatigue crack initiation site was determined by electron backscatter diffraction (EBSD) method in scanning electron microscope (SEM) to understand the fatigue crack initiation mechanism and discuss on the low fatigue strength at low temperature. Furthermore, in terms of the practical use of this alloy, the effect of the stress ratio (or mean stress) on the high-cycle fatigue properties was evaluated using the modified Goodman diagram.

• OSTI ID: 22264048
• Journal Information: AIP Conference Proceedings, Vol. 1574, Issue 1; Conference: International cryogenic materials conference, Anchorage, AK (United States), 17-21 Jun 2013; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ALLOYS
AMBIENT TEMPERATURE
BACKSCATTERING
CRACK PROPAGATION
CRYSTALLOGRAPHY
ELECTRON DIFFRACTION
ELECTRONS
FATIGUE
FORGING
ORIENTATION
SCANNING ELECTRON MICROSCOPY
TEMPERATURE RANGE 0065-0273 K