Effects of porous carbon additives and induced fluorine on low dielectric constant polyimide synthesized with an e-beam
- Department of Fine Chemical Engineering and Applied Chemistry, BK21-E2M, Chungnam National University, Yuseong-Gu, Daejeon 305-764 (Korea, Republic of)
- Korea Basic Science Institute (KBSI), Jeonju 561-756 (Korea, Republic of)
- Department of Electrical and Electronic Engineering, Korea Polytechnic IV College, Daejeon 300-702 (Korea, Republic of)
- Radiation Research Division for Industry and Environment, Advanced Radiation Technology Institute, Korea Atomic Energy Research Institute, Jeollabuk-do 580-185 (Korea, Republic of)
We report the synthesis of a polyimide matrix with a low dielectric constant for application as an intercalation material between metal interconnections in electronic devices. Porous activated carbon was embedded in the polyimide to reduce the dielectric constant, and a thin film of the complex was obtained using the spin-coating and e-beam irradiation methods. The surface of the thin film was modified with fluorine functional groups to impart water resistance and reduce the dielectric constant further. The water resistance was significantly improved by the modification with hydrophobic fluorine groups. The dielectric constant was effectively decreased by porous activated carbon. The fluorine modification also resulted in a low dielectric constant on the polyimide surface by reducing the polar surface free energy. The dielectric constant of polyimide film decreased from 2.98 to 1.9 by effects of porous activated carbon additive and fluorine surface modification.
- OSTI ID:
- 22202854
- Journal Information:
- Materials Research Bulletin, Vol. 45, Issue 11; Other Information: Copyright (c) 2010 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); ISSN 0025-5408
- Country of Publication:
- United States
- Language:
- English
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