Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam
- National Chiao Tung University, Department of Materials Science and Engineering, Hsinchu 30010, Taiwan, ROC (China)
- Integrated Service Technology Inc., No. 19, Pu-ding Rd., Hsinchu 30072, Taiwan, ROC (China)
- National Cheng Kung University, Department of Materials Science and Engineering, Tainan, Taiwan, ROC (China)
We proposed a novel technique developed from focused ion beam (FIB) polishing for sample preparation of electron backscatter diffraction (EBSD) measurement. A low-angle incident gallium ion beam with a high acceleration voltage of 30 kV was used to eliminate the surface roughness of cross-sectioned microbumps resulting from mechanical polishing. This work demonstrates the application of the FIB polishing technique to solders for a high-quality sample preparation for EBSD measurement after mechanical polishing. - Highlights: Black-Right-Pointing-Pointer The novel FIB technique of sample preparation is fast, effective and low-cost. Black-Right-Pointing-Pointer It can enhance the process precision to the specific area of the sample. Black-Right-Pointing-Pointer It is convenient for analyzing the metallurgy of the microbump in 3DIC packaging. Black-Right-Pointing-Pointer The EBSD image quality can be enhanced by just using a common FIB instrument.
- OSTI ID:
- 22163160
- Journal Information:
- Materials Characterization, Vol. 74, Issue Complete; Other Information: Copyright (c) 2012 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); ISSN 1044-5803
- Country of Publication:
- United States
- Language:
- English
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