Three-dimensional imaging of copper pillars using x-ray tomography within a scanning electron microscope: A simulation study based on synchrotron data

Journal Article · Fri Feb 15 00:00:00 EST 2013 · Review of Scientific Instruments

DOI:https://doi.org/10.1063/1.4792377· OSTI ID:22105410

Martin, N.; Bertheau, J.; Charbonnier, J.; Hugonnard, P.; Lorut, F. ^[1]; Bleuet, P.; Tabary, J. ^[2]; Laloum, D. ^[1]

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1. ST Microelectronics, 850 Rue Jean Monnet, 38920 Crolles (France)
2. CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9 (France)

While microelectronic devices are frequently characterized with surface-sensitive techniques having nanometer resolution, interconnections used in 3D integration require 3D imaging with high penetration depth and deep sub-micrometer spatial resolution. X-ray tomography is well adapted to this situation. In this context, the purpose of this study is to assess a versatile and turn-key tomographic system allowing for 3D x-ray nanotomography of copper pillars. The tomography tool uses the thin electron beam of a scanning electron microscope (SEM) to provoke x-ray emission from specific metallic targets. Then, radiographs are recorded while the sample rotates in a conventional cone beam tomography scheme that ends up with 3D reconstructions of the pillar. Starting from copper pillars data, collected at the European Synchrotron Radiation Facility, we build a 3D numerical model of a copper pillar, paying particular attention to intermetallics. This model is then used to simulate physical radiographs of the pillar using the geometry of the SEM-hosted x-ray tomography system. Eventually, data are reconstructed and it is shown that the system makes it possible the quantification of 3D intermetallics volume in copper pillars. The paper also includes a prospective discussion about resolution issues.

• OSTI ID: 22105410
• Journal Information: Review of Scientific Instruments, Vol. 84, Issue 2; Other Information: (c) 2013 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0034-6748
• Country of Publication: United States
• Language: English

Related Subjects

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY
COMPUTERIZED SIMULATION
COMPUTERIZED TOMOGRAPHY
COPPER
ELECTRON BEAMS
EUROPEAN SYNCHROTRON RADIATION FACILITY
INTEGRATED CIRCUITS
INTERMETALLIC COMPOUNDS
SCANNING ELECTRON MICROSCOPY
SPATIAL RESOLUTION
SYNCHROTRONS
THREE-DIMENSIONAL CALCULATIONS
X RADIATION