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Title: Diffusion bonding titanium to stainless steel using Nb/Cu/Ni multi-interlayer

Abstract

By using Nb/Cu/Ni structure as multi-interlayer, diffusion bonding titanium to austenitic stainless steel has been conducted. The effects of bonding temperature and bonding time on the interfacial microstructure were analyzed by scanning electron microscope equipped with energy dispersive spectroscope, and the joint strength was evaluated by tensile test. The results showed that Ni atoms aggregated at the Cu-Nb interface, which promoted Cu solution in Nb. This phenomenon forms a Cu-Nb solution strengthening effect. However, such effect would decay by using long bonding time that dilutes Ni atom aggregation, or be suppressed by using high bonding temperature that embrittles the Cu-Nb interface due to the formation of large grown intermetallic compounds. The sound joint was obtained by promoted parameters as 850 Degree-Sign C for 30-45 min, under which a bonding strength around 300 MPa could be obtained. - Highlights: Black-Right-Pointing-Pointer Titanium was diffusion bonded to stainless steel using Nb/Cu/Ni multi-interlayer. Black-Right-Pointing-Pointer The effects of bonding parameters on microstructure and joint strength were studied. Black-Right-Pointing-Pointer Nickel aggregation promotes Cu solution in Nb which can strengthen the joint. Black-Right-Pointing-Pointer The sound joint with strength of around 300 MPa was obtained by promoted parameters.

Authors:
 [1];  [2];  [3]; ; ;  [3]
  1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072 (China)
  2. (China)
  3. Shaanxi Key Laboratory of Friction Welding Technologies, Northwestern Polytechnical University, Xi'an 710072 (China)
Publication Date:
OSTI Identifier:
22066460
Resource Type:
Journal Article
Journal Name:
Materials Characterization
Additional Journal Information:
Journal Volume: 68; Journal Issue: Complete; Other Information: Copyright (c) 2012 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 1044-5803
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; AGGLOMERATION; AUSTENITIC STEELS; BONDING; COPPER; DIFFUSION; INTERFACES; INTERMETALLIC COMPOUNDS; JOINTS; MICROSTRUCTURE; NICKEL; NIOBIUM; SCANNING ELECTRON MICROSCOPY; SOUND WAVES; STAINLESS STEELS; TENSILE PROPERTIES; TITANIUM

Citation Formats

Li Peng, Shaanxi Key Laboratory of Friction Welding Technologies, Northwestern Polytechnical University, Xi'an 710072, Li Jinglong, E-mail: lijinglg@nwpu.edu.cn, Xiong Jiangtao, Zhang Fusheng, and Raza, Syed Hamid. Diffusion bonding titanium to stainless steel using Nb/Cu/Ni multi-interlayer. United States: N. p., 2012. Web. doi:10.1016/J.MATCHAR.2012.03.016.
Li Peng, Shaanxi Key Laboratory of Friction Welding Technologies, Northwestern Polytechnical University, Xi'an 710072, Li Jinglong, E-mail: lijinglg@nwpu.edu.cn, Xiong Jiangtao, Zhang Fusheng, & Raza, Syed Hamid. Diffusion bonding titanium to stainless steel using Nb/Cu/Ni multi-interlayer. United States. doi:10.1016/J.MATCHAR.2012.03.016.
Li Peng, Shaanxi Key Laboratory of Friction Welding Technologies, Northwestern Polytechnical University, Xi'an 710072, Li Jinglong, E-mail: lijinglg@nwpu.edu.cn, Xiong Jiangtao, Zhang Fusheng, and Raza, Syed Hamid. Fri . "Diffusion bonding titanium to stainless steel using Nb/Cu/Ni multi-interlayer". United States. doi:10.1016/J.MATCHAR.2012.03.016.
@article{osti_22066460,
title = {Diffusion bonding titanium to stainless steel using Nb/Cu/Ni multi-interlayer},
author = {Li Peng and Shaanxi Key Laboratory of Friction Welding Technologies, Northwestern Polytechnical University, Xi'an 710072 and Li Jinglong, E-mail: lijinglg@nwpu.edu.cn and Xiong Jiangtao and Zhang Fusheng and Raza, Syed Hamid},
abstractNote = {By using Nb/Cu/Ni structure as multi-interlayer, diffusion bonding titanium to austenitic stainless steel has been conducted. The effects of bonding temperature and bonding time on the interfacial microstructure were analyzed by scanning electron microscope equipped with energy dispersive spectroscope, and the joint strength was evaluated by tensile test. The results showed that Ni atoms aggregated at the Cu-Nb interface, which promoted Cu solution in Nb. This phenomenon forms a Cu-Nb solution strengthening effect. However, such effect would decay by using long bonding time that dilutes Ni atom aggregation, or be suppressed by using high bonding temperature that embrittles the Cu-Nb interface due to the formation of large grown intermetallic compounds. The sound joint was obtained by promoted parameters as 850 Degree-Sign C for 30-45 min, under which a bonding strength around 300 MPa could be obtained. - Highlights: Black-Right-Pointing-Pointer Titanium was diffusion bonded to stainless steel using Nb/Cu/Ni multi-interlayer. Black-Right-Pointing-Pointer The effects of bonding parameters on microstructure and joint strength were studied. Black-Right-Pointing-Pointer Nickel aggregation promotes Cu solution in Nb which can strengthen the joint. Black-Right-Pointing-Pointer The sound joint with strength of around 300 MPa was obtained by promoted parameters.},
doi = {10.1016/J.MATCHAR.2012.03.016},
journal = {Materials Characterization},
issn = {1044-5803},
number = Complete,
volume = 68,
place = {United States},
year = {2012},
month = {6}
}