skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Influence of current density on microstructure of pulse electrodeposited tin coatings

Abstract

Pulse electrodeposited tin coatings on copper substrate have been synthesized from an aqueous solution containing sodium stannate (Na{sub 2}SnO{sub 3}.3H{sub 2}O) and sodium hydroxide (NaOH). The effect of current density on surface morphology of the deposits has been investigated. As deposited coatings are characterized by X-ray diffraction, scanning electron microscopy, electron backscatter diffraction, and line profile analysis. The X-ray diffraction analysis shows that the deposits consist of tetragonal ({beta}-Sn) structure with microcrystalline grains. The deposits plated at lower current density exhibit (110) texture which decreases with increasing current densities. The effects of current density on Cu-Sn diffusion and whisker growth of the electrodeposited tin coatings are also reported here. - Highlights: Black-Right-Pointing-Pointer Pulse electrodeposition of Sn from aqueous alkaline solution without adding any organic additive. Black-Right-Pointing-Pointer Effect of current density on morphology and whisker growth in tin coatings aged for 1 year. Black-Right-Pointing-Pointer Solution bath is stable and can be operated over a wide range of current density.

Authors:
; ; ;  [1];  [2];  [1];  [1]
  1. Department of Metallurgical and Materials Engineering, Indian Institute of Technology-Kharagpur, Kharagpur-721302 (India)
  2. Institut fuer Mikro- und Nanomaterialien, Universitaet Ulm, D-89081 Ulm (Germany)
Publication Date:
OSTI Identifier:
22066452
Resource Type:
Journal Article
Journal Name:
Materials Characterization
Additional Journal Information:
Journal Volume: 68; Journal Issue: Complete; Other Information: Copyright (c) 2012 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 1044-5803
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; AQUEOUS SOLUTIONS; COATINGS; COPPER; CRYSTAL GROWTH; CURRENT DENSITY; DIFFUSION; ELECTRODEPOSITION; MICROSTRUCTURE; MORPHOLOGY; PULSES; SCANNING ELECTRON MICROSCOPY; SODIUM HYDROXIDES; SUBSTRATES; TETRAGONAL LATTICES; TEXTURE; TIN; X-RAY DIFFRACTION

Citation Formats

Sharma, Ashutosh, Bhattacharya, Sumit, Sen, Ranjan, Reddy, B.S.B., Fecht, H.-J., Das, Karabi, E-mail: karabi@metal.iitkgp.ernet.in, and Das, Siddhartha. Influence of current density on microstructure of pulse electrodeposited tin coatings. United States: N. p., 2012. Web. doi:10.1016/J.MATCHAR.2012.03.002.
Sharma, Ashutosh, Bhattacharya, Sumit, Sen, Ranjan, Reddy, B.S.B., Fecht, H.-J., Das, Karabi, E-mail: karabi@metal.iitkgp.ernet.in, & Das, Siddhartha. Influence of current density on microstructure of pulse electrodeposited tin coatings. United States. doi:10.1016/J.MATCHAR.2012.03.002.
Sharma, Ashutosh, Bhattacharya, Sumit, Sen, Ranjan, Reddy, B.S.B., Fecht, H.-J., Das, Karabi, E-mail: karabi@metal.iitkgp.ernet.in, and Das, Siddhartha. Fri . "Influence of current density on microstructure of pulse electrodeposited tin coatings". United States. doi:10.1016/J.MATCHAR.2012.03.002.
@article{osti_22066452,
title = {Influence of current density on microstructure of pulse electrodeposited tin coatings},
author = {Sharma, Ashutosh and Bhattacharya, Sumit and Sen, Ranjan and Reddy, B.S.B. and Fecht, H.-J. and Das, Karabi, E-mail: karabi@metal.iitkgp.ernet.in and Das, Siddhartha},
abstractNote = {Pulse electrodeposited tin coatings on copper substrate have been synthesized from an aqueous solution containing sodium stannate (Na{sub 2}SnO{sub 3}.3H{sub 2}O) and sodium hydroxide (NaOH). The effect of current density on surface morphology of the deposits has been investigated. As deposited coatings are characterized by X-ray diffraction, scanning electron microscopy, electron backscatter diffraction, and line profile analysis. The X-ray diffraction analysis shows that the deposits consist of tetragonal ({beta}-Sn) structure with microcrystalline grains. The deposits plated at lower current density exhibit (110) texture which decreases with increasing current densities. The effects of current density on Cu-Sn diffusion and whisker growth of the electrodeposited tin coatings are also reported here. - Highlights: Black-Right-Pointing-Pointer Pulse electrodeposition of Sn from aqueous alkaline solution without adding any organic additive. Black-Right-Pointing-Pointer Effect of current density on morphology and whisker growth in tin coatings aged for 1 year. Black-Right-Pointing-Pointer Solution bath is stable and can be operated over a wide range of current density.},
doi = {10.1016/J.MATCHAR.2012.03.002},
journal = {Materials Characterization},
issn = {1044-5803},
number = Complete,
volume = 68,
place = {United States},
year = {2012},
month = {6}
}