Investigation of shear-banding mechanism in fully dense nanocrystalline Ni sheet

Journal Article · Thu Apr 15 00:00:00 EDT 2010 · Materials Characterization

DOI:https://doi.org/10.1016/J.MATCHAR.2010.01.004· OSTI ID:22066197

Rongtao, Zhu ^[1]; Xinbo, Li; Hua, Jiang; Xiang, Ling ^[1]

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1. Department of Mechanical Engineering, Nanjing University of Technology, Nanjing, Jiangsu 210009 (China)

Evolution of shear banding in fully dense electrodeposited nanocrystalline Ni was successfully monitored by using a digital image correlation technique under a quasi-static uniaxial tensile load. To investigate the microscopic physical mechanism of the shear banding, in-situ tensile testing for the nanocrystalline Ni sample was conducted in a transmission electron microscope and fracture surface of the sample was examined by field emission scanning electron microscope. The results suggest that grain boundary migration based on atomic diffusion is a main carrier of the shear banding.

• OSTI ID: 22066197
• Journal Information: Materials Characterization, Vol. 61, Issue 4; Other Information: Copyright (c) 2010 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); ISSN 1044-5803
• Country of Publication: United States
• Language: English

Related Subjects

77 NANOSCIENCE AND NANOTECHNOLOGY
CORRELATIONS
CRYSTALS
DIFFUSION
ELECTRODEPOSITION
FIELD EMISSION
FRACTURES
GRAIN BOUNDARIES
IMAGES
MATERIALS TESTING
NANOSTRUCTURES
NICKEL
SCANNING ELECTRON MICROSCOPY
SHEAR
SHEETS
SURFACES
TRANSMISSION ELECTRON MICROSCOPY