Influence of crystal orientation on pattern formation of focused-ion-beam milled Cu surfaces

Journal Article · Fri Jul 15 00:00:00 EDT 2011 · Physical Review. B, Condensed Matter and Materials Physics

DOI:https://doi.org/10.1103/PHYSREVB.84.035451· OSTI ID:21596830

Lenius, Maria; Volkert, Cynthia A ^[1]; Kree, Reiner ^[2]

---

1. Institut fuer Materialphysik, Universitaet Goettingen, D-37077 Goettingen (Germany)
2. Institut fuer Theoretische Physik, Universitaet Goettingen, D-37077 Goettingen (Germany)

The erosion profiles of Cu surfaces after focused ion beam sputtering have been investigated as a function of crystal orientation and ion beam incidence. We find that all patterns are aligned with crystallographic axes and have wavelengths of about 0.5{mu}m. The patterns depend strongly on the crystal orientation, typically with similar patterns for neighboring orientations, but may also be influenced by the ion beam direction. For orientations close to (100), we find however that surfaces stay smooth for all incidence angles. The results are discussed in the context of current continuum models and indicate that modifications to the models are required to account for the effect of crystal orientation.

• OSTI ID: 21596830
• Journal Information: Physical Review. B, Condensed Matter and Materials Physics, Vol. 84, Issue 3; Other Information: DOI: 10.1103/PhysRevB.84.035451; (c) 2011 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 1098-0121
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
COPPER
CRYSTALLOGRAPHY
CRYSTALS
INCIDENCE ANGLE
ION BEAMS
MODIFICATIONS
ORIENTATION
PHYSICAL RADIATION EFFECTS
SPUTTERING
SURFACES
WAVELENGTHS
BEAMS
ELEMENTS
METALS
RADIATION EFFECTS
TRANSITION ELEMENTS