Measuring Joule heating and strain induced by electrical current with Moire interferometry
- Electronic Packaging Laboratory, State University of New York at Buffalo, 102 Ketter Hall, Buffalo, New York 14260 (United States)
This study proposes a new method to locate and measure the temperature of the hot spots caused by Joule Heating by measuring the free thermal expansion in-plane strain. It is demonstrated that the hotspot caused by the Joule heating in a thin metal film/plate structure can be measured by Phase shifting Moire interferometry with continuous wavelet transform (PSMI/CWT) at the microscopic scale. A demonstration on a copper film is conducted to verify the theory under different current densities. A correlation between the current density and strain in two orthogonal directions (one in the direction of the current flow) is proposed. The method can also be used for the measurement of the Joule heating in the microscopic solid structures in the electronic packaging devices. It is shown that a linear relationship exists between current density squared and normal strains.
- OSTI ID:
- 21538235
- Journal Information:
- Journal of Applied Physics, Vol. 109, Issue 7; Other Information: DOI: 10.1063/1.3565045; (c) 2011 American Institute of Physics; ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
GENERAL PHYSICS
COPPER
CORRELATIONS
CURRENT DENSITY
ELECTRIC CURRENTS
INTERFEROMETRY
JOULE HEATING
PACKAGING
SOLIDS
STRAINS
TEMPERATURE MEASUREMENT
THERMAL EXPANSION
THIN FILMS
CURRENTS
ELECTRIC HEATING
ELEMENTS
EXPANSION
FILMS
HEATING
METALS
PLASMA HEATING
TRANSITION ELEMENTS