Self-sputtering runaway in high power impulse magnetron sputtering: The role of secondary electrons and multiply charged metal ions
- Lawrence Berkeley National Laboratory, University of California, 1 Cyclotron Road, Berkeley, California 94720 (United States)
Self-sputtering runaway in high power impulse magnetron sputtering is closely related to the appearance of multiply charged ions. This conclusion is based on the properties of potential emission of secondary electrons and energy balance considerations. The effect is especially strong for materials whose sputtering yield is marginally greater than unity. The absolute deposition rate increases {approx}Q{sup 1/2}, whereas the rate normalized to the average power decreases {approx}Q{sup -1/2}, with Q being the mean ion charge state number.
- OSTI ID:
- 21102020
- Journal Information:
- Applied Physics Letters, Vol. 92, Issue 20; Other Information: DOI: 10.1063/1.2936307; (c) 2008 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
- Country of Publication:
- United States
- Language:
- English
Similar Records
Spatial distribution of average charge state and deposition rate in high power impulse magnetron sputtering of copper
Self-organization and self-limitation in high power impulse magnetron sputtering
Observation of Ti{sup 4+} ions in a high power impulse magnetron sputtering plasma
Journal Article
·
Sat May 10 00:00:00 EDT 2008
· Journal of Physics D
·
OSTI ID:21102020
Self-organization and self-limitation in high power impulse magnetron sputtering
Journal Article
·
Mon May 28 00:00:00 EDT 2012
· Applied Physics Letters
·
OSTI ID:21102020
Observation of Ti{sup 4+} ions in a high power impulse magnetron sputtering plasma
Journal Article
·
Mon Aug 18 00:00:00 EDT 2008
· Applied Physics Letters
·
OSTI ID:21102020