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Title: The Surface Morphology Characterization of Electroless Nickel Immersion Gold Under Bump Metallurgy (UBM) Using SEM

Abstract

This paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond pad, followed by cleaning, activation, first zincation, zinc removal, second zincation, electroless nickel and lastly immersion gold process. The result shows that the surface morphology of initial bond pad starts to change with deposition of zinc layer and further changes with deposition of nickel and gold layer.

Authors:
; ;  [1]
  1. School of Microelectronic, Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), Blok A, Kompleks Pusat Pengajian KUKUM, Jalan Kangar-Arau, 02600 Jejawi, Perlis (Malaysia)
Publication Date:
OSTI Identifier:
21061695
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 909; Journal Issue: 1; Conference: ICSSST 2006: 2. international conference on solid state science and technology 2006, Kuala Terengganu (Malaysia), 4-6 Sep 2006; Other Information: DOI: 10.1063/1.2739836; (c) 2007 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; COATINGS; CRYSTAL STRUCTURE; DEPOSITION; GOLD; LAYERS; MORPHOLOGY; NICKEL; SCANNING ELECTRON MICROSCOPY; SURFACES; ZINC

Citation Formats

Arshad, M. K. Md, Isa, M. N. Md, and Sohiful, Z. M. A. The Surface Morphology Characterization of Electroless Nickel Immersion Gold Under Bump Metallurgy (UBM) Using SEM. United States: N. p., 2007. Web. doi:10.1063/1.2739836.
Arshad, M. K. Md, Isa, M. N. Md, & Sohiful, Z. M. A. The Surface Morphology Characterization of Electroless Nickel Immersion Gold Under Bump Metallurgy (UBM) Using SEM. United States. doi:10.1063/1.2739836.
Arshad, M. K. Md, Isa, M. N. Md, and Sohiful, Z. M. A. Wed . "The Surface Morphology Characterization of Electroless Nickel Immersion Gold Under Bump Metallurgy (UBM) Using SEM". United States. doi:10.1063/1.2739836.
@article{osti_21061695,
title = {The Surface Morphology Characterization of Electroless Nickel Immersion Gold Under Bump Metallurgy (UBM) Using SEM},
author = {Arshad, M. K. Md and Isa, M. N. Md and Sohiful, Z. M. A.},
abstractNote = {This paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond pad, followed by cleaning, activation, first zincation, zinc removal, second zincation, electroless nickel and lastly immersion gold process. The result shows that the surface morphology of initial bond pad starts to change with deposition of zinc layer and further changes with deposition of nickel and gold layer.},
doi = {10.1063/1.2739836},
journal = {AIP Conference Proceedings},
number = 1,
volume = 909,
place = {United States},
year = {Wed May 09 00:00:00 EDT 2007},
month = {Wed May 09 00:00:00 EDT 2007}
}