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Title: A New Modelling of Dynamic Recrystallization - Application to Blanking Process of Thin Sheet in Copper Alloy

Abstract

Blanking process is widely used by electronic and micromechanical industries to produce small and thin components in large quantities. To take into consideration the influence of strain rate and temperature on precision blanking of thin sheet in copper alloy, a thermo-elasto-visco-plastic modelling has been developed. Furthermore the blanking of thin sheet in Cual copper presents dynamic recrystallization. A new modelling of dynamic recrystallization based on the thermodynamics of irreversible processes is proposed. Blanking simulations of Cual copper sheet are performed to analyze the softening effect induced by dynamic recrystallization.

Authors:
; ; ;  [1]
  1. Universite de Franche-Comte, Institut FEMTO-ST - UMR 6174, Laboratoire de Mecanique Appliquee R. Chaleat, 24 rue de l'Epitaphe, 25000 Besancon (France)
Publication Date:
OSTI Identifier:
21057076
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 907; Journal Issue: 1; Conference: 10. ESAFORM conference on material forming, Zaragoza (Spain), 18-20 Apr 2007; Other Information: DOI: 10.1063/1.2729595; (c) 2007 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ACCURACY; COMPUTERIZED SIMULATION; COPPER; COPPER ALLOYS; IRREVERSIBLE PROCESSES; PLASTICITY; RECRYSTALLIZATION; SHEETS; STRAIN RATE; TEMPERATURE DEPENDENCE; THERMODYNAMICS; THERMOELASTICITY; VISCOSITY

Citation Formats

Thibaud, Sebastien, Touache, Abdelhamid, Chambert, Jerome, and Picart, Philippe. A New Modelling of Dynamic Recrystallization - Application to Blanking Process of Thin Sheet in Copper Alloy. United States: N. p., 2007. Web. doi:10.1063/1.2729595.
Thibaud, Sebastien, Touache, Abdelhamid, Chambert, Jerome, & Picart, Philippe. A New Modelling of Dynamic Recrystallization - Application to Blanking Process of Thin Sheet in Copper Alloy. United States. doi:10.1063/1.2729595.
Thibaud, Sebastien, Touache, Abdelhamid, Chambert, Jerome, and Picart, Philippe. Sat . "A New Modelling of Dynamic Recrystallization - Application to Blanking Process of Thin Sheet in Copper Alloy". United States. doi:10.1063/1.2729595.
@article{osti_21057076,
title = {A New Modelling of Dynamic Recrystallization - Application to Blanking Process of Thin Sheet in Copper Alloy},
author = {Thibaud, Sebastien and Touache, Abdelhamid and Chambert, Jerome and Picart, Philippe},
abstractNote = {Blanking process is widely used by electronic and micromechanical industries to produce small and thin components in large quantities. To take into consideration the influence of strain rate and temperature on precision blanking of thin sheet in copper alloy, a thermo-elasto-visco-plastic modelling has been developed. Furthermore the blanking of thin sheet in Cual copper presents dynamic recrystallization. A new modelling of dynamic recrystallization based on the thermodynamics of irreversible processes is proposed. Blanking simulations of Cual copper sheet are performed to analyze the softening effect induced by dynamic recrystallization.},
doi = {10.1063/1.2729595},
journal = {AIP Conference Proceedings},
number = 1,
volume = 907,
place = {United States},
year = {Sat Apr 07 00:00:00 EDT 2007},
month = {Sat Apr 07 00:00:00 EDT 2007}
}