1.5-nm-thick silicon oxide gate films grown at 150 deg. C using modified reactive ion beam deposition with pyrolytic-gas passivation
- NTT Microsystem Integration Laboratories, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198 (Japan)
Low-temperature ultrathin silicon oxide gate film growth using modified reactive ion beam deposition (RIBD) with an in situ pyrolytic-gas passivation (PGP) method is described. RIBD uses low-energy-controlled reactive and ionized species and potentializes low-temperature film growth. By combining RIBD with PGP using N{sub 2}O and NF{sub 3}, 1.5-nm-thick silicon oxide gate films with high-potential barrier height energy, 3.51 eV, and low-leakage current, less than about 10{sup -5} A/cm{sup 2} at 2 MV/cm, can be obtained at a growth temperature of 150 deg. C. From an evaluation of number densities of N, F, and O atoms near the 1.5-5.0-nm-thick RIBD-with-PGP silicon oxide films/Si(100) interfaces, it is believed that interfacial N and F atoms contribute to improve the electrical characteristics and F effectively compensates the residual inconsistent-state bonding sites after the N passivation.
- OSTI ID:
- 20979392
- Journal Information:
- Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films, Vol. 25, Issue 2; Other Information: DOI: 10.1116/1.2699503; (c) 2007 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA); ISSN 1553-1813
- Country of Publication:
- United States
- Language:
- English
Similar Records
Epitaxial GeSn film formed by solid phase epitaxy and its application to Yb{sub 2}O{sub 3}-gated GeSn metal-oxide-semiconductor capacitors with sub-nm equivalent oxide thickness
Low interfacial trap density and sub-nm equivalent oxide thickness in In{sub 0.53}Ga{sub 0.47}As (001) metal-oxide-semiconductor devices using molecular beam deposited HfO{sub 2}/Al{sub 2}O{sub 3} as gate dielectrics