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Title: Localized etching of an insulator film coated on a copper wire using an atmospheric-pressure microplasma jet

Abstract

Atmospheric-pressure microplasma jets (AP{mu}PJs) of Ar and Ar/O{sub 2} gases were generated from the tip of a stainless steel surgical needle having outer and inner diameters of 0.4 and 0.2 mm, respectively, with a rf excitation of 13.56 MHz. The steel needle functions both as a powered electrode and a gas nozzle. The operating power is 1.2-6 W and the corresponding peak-to-peak voltage Vp.p. is about 1.5 kV. The AP{mu}PJ was applied to the localized etching of a polyamide-imide insulator film (thickness of 10 {mu}m) of a copper winding wire of 90 {mu}m diameter. The insulator film around the copper wire was completely removed by the irradiated plasma from a certain direction without fusing the wire. The removal time under the Ar AP{mu}PJ irradiation was only 3 s at a rf power of 4 W. Fluorescence microscopy and scanning electron microscope images reveal that good selectivity of the insulator film to the copper wire was achieved. In the case of Ar/O{sub 2} AP{mu}PJ irradiation with an O{sub 2} concentration of 10% or more, the removed copper surface was converted to copper monoxide CuO.

Authors:
 [1]
  1. Tsuruoka National College of Technology, Inooka-Sawada 104, Tsuruoka, Yamagata 997-8511 (Japan)
Publication Date:
OSTI Identifier:
20953423
Resource Type:
Journal Article
Resource Relation:
Journal Name: Review of Scientific Instruments; Journal Volume: 78; Journal Issue: 4; Other Information: DOI: 10.1063/1.2727488; (c) 2007 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ATMOSPHERIC PRESSURE; COPPER; COPPER OXIDES; ETCHING; FLUORESCENCE; GASES; IRRADIATION; OPTICAL MICROSCOPY; PEAKS; PLASMA; POLYAMIDES; SCANNING ELECTRON MICROSCOPY; STAINLESS STEELS; THIN FILMS; WIRES

Citation Formats

Yoshiki, Hiroyuki. Localized etching of an insulator film coated on a copper wire using an atmospheric-pressure microplasma jet. United States: N. p., 2007. Web. doi:10.1063/1.2727488.
Yoshiki, Hiroyuki. Localized etching of an insulator film coated on a copper wire using an atmospheric-pressure microplasma jet. United States. doi:10.1063/1.2727488.
Yoshiki, Hiroyuki. Sun . "Localized etching of an insulator film coated on a copper wire using an atmospheric-pressure microplasma jet". United States. doi:10.1063/1.2727488.
@article{osti_20953423,
title = {Localized etching of an insulator film coated on a copper wire using an atmospheric-pressure microplasma jet},
author = {Yoshiki, Hiroyuki},
abstractNote = {Atmospheric-pressure microplasma jets (AP{mu}PJs) of Ar and Ar/O{sub 2} gases were generated from the tip of a stainless steel surgical needle having outer and inner diameters of 0.4 and 0.2 mm, respectively, with a rf excitation of 13.56 MHz. The steel needle functions both as a powered electrode and a gas nozzle. The operating power is 1.2-6 W and the corresponding peak-to-peak voltage Vp.p. is about 1.5 kV. The AP{mu}PJ was applied to the localized etching of a polyamide-imide insulator film (thickness of 10 {mu}m) of a copper winding wire of 90 {mu}m diameter. The insulator film around the copper wire was completely removed by the irradiated plasma from a certain direction without fusing the wire. The removal time under the Ar AP{mu}PJ irradiation was only 3 s at a rf power of 4 W. Fluorescence microscopy and scanning electron microscope images reveal that good selectivity of the insulator film to the copper wire was achieved. In the case of Ar/O{sub 2} AP{mu}PJ irradiation with an O{sub 2} concentration of 10% or more, the removed copper surface was converted to copper monoxide CuO.},
doi = {10.1063/1.2727488},
journal = {Review of Scientific Instruments},
number = 4,
volume = 78,
place = {United States},
year = {Sun Apr 15 00:00:00 EDT 2007},
month = {Sun Apr 15 00:00:00 EDT 2007}
}