skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Measuring the thickness profiles of wafers to subnanometer resolution using Fabry-Perot interferometry

Abstract

The resolution of an angle-scanning technique for measuring transparent optical wafers is analyzed, and it is shown both theoretically and experimentally that subnanometer resolution can be readily achieved. Data are acquired simultaneously over the whole area of the wafer, producing two-dimensional thickness variation maps in as little as 10 s.Repeatabilities of 0.07 nm have been demonstrated, and wafers of up to100 mm diameter have been measured, with1 mm or better spatial resolution. A technique for compensating wafer and system aberrations is incorporated and analyzed.

Authors:
; ; ;
Publication Date:
OSTI Identifier:
20929731
Resource Type:
Journal Article
Resource Relation:
Journal Name: Applied Optics; Journal Volume: 46; Journal Issue: 15; Other Information: DOI: 10.1364/AO.46.002863; (c) 2007 Optical Society of America; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; 36 MATERIALS SCIENCE; DATA ACQUISITION SYSTEMS; FABRY-PEROT INTERFEROMETER; INTERFEROMETRY; LITHIUM COMPOUNDS; MAPS; MEASURING METHODS; NANOSTRUCTURES; NIOBIUM COMPOUNDS; RESONATORS; SPATIAL RESOLUTION; THICKNESS; TWO-DIMENSIONAL CALCULATIONS

Citation Formats

Farrant, David I., Arkwright, John W., Fairman, Philip S., and Netterfield, Roger P. Measuring the thickness profiles of wafers to subnanometer resolution using Fabry-Perot interferometry. United States: N. p., 2007. Web. doi:10.1364/AO.46.002863.
Farrant, David I., Arkwright, John W., Fairman, Philip S., & Netterfield, Roger P. Measuring the thickness profiles of wafers to subnanometer resolution using Fabry-Perot interferometry. United States. doi:10.1364/AO.46.002863.
Farrant, David I., Arkwright, John W., Fairman, Philip S., and Netterfield, Roger P. Sun . "Measuring the thickness profiles of wafers to subnanometer resolution using Fabry-Perot interferometry". United States. doi:10.1364/AO.46.002863.
@article{osti_20929731,
title = {Measuring the thickness profiles of wafers to subnanometer resolution using Fabry-Perot interferometry},
author = {Farrant, David I. and Arkwright, John W. and Fairman, Philip S. and Netterfield, Roger P},
abstractNote = {The resolution of an angle-scanning technique for measuring transparent optical wafers is analyzed, and it is shown both theoretically and experimentally that subnanometer resolution can be readily achieved. Data are acquired simultaneously over the whole area of the wafer, producing two-dimensional thickness variation maps in as little as 10 s.Repeatabilities of 0.07 nm have been demonstrated, and wafers of up to100 mm diameter have been measured, with1 mm or better spatial resolution. A technique for compensating wafer and system aberrations is incorporated and analyzed.},
doi = {10.1364/AO.46.002863},
journal = {Applied Optics},
number = 15,
volume = 46,
place = {United States},
year = {Sun May 20 00:00:00 EDT 2007},
month = {Sun May 20 00:00:00 EDT 2007}
}