Measuring the thickness profiles of wafers to subnanometer resolution using Fabry-Perot interferometry

Journal Article · Sun May 20 00:00:00 EDT 2007 · Applied Optics

DOI:https://doi.org/10.1364/AO.46.002863· OSTI ID:20929731

Farrant, David I; Arkwright, John W; Fairman, Philip S; Netterfield, Roger P

The resolution of an angle-scanning technique for measuring transparent optical wafers is analyzed, and it is shown both theoretically and experimentally that subnanometer resolution can be readily achieved. Data are acquired simultaneously over the whole area of the wafer, producing two-dimensional thickness variation maps in as little as 10 s.Repeatabilities of 0.07 nm have been demonstrated, and wafers of up to100 mm diameter have been measured, with1 mm or better spatial resolution. A technique for compensating wafer and system aberrations is incorporated and analyzed.

• OSTI ID: 20929731
• Journal Information: Applied Optics, Vol. 46, Issue 15; Other Information: DOI: 10.1364/AO.46.002863; (c) 2007 Optical Society of America; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6935
• Country of Publication: United States
• Language: English

Related Subjects

71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
36 MATERIALS SCIENCE
DATA ACQUISITION SYSTEMS
FABRY-PEROT INTERFEROMETER
INTERFEROMETRY
LITHIUM COMPOUNDS
MAPS
MEASURING METHODS
NANOSTRUCTURES
NIOBIUM COMPOUNDS
RESONATORS
SPATIAL RESOLUTION
THICKNESS
TWO-DIMENSIONAL CALCULATIONS