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Title: High-power pulsed sputtering using a magnetron with enhanced plasma confinement

Abstract

High-power pulsed dc magnetron discharges for ionized high-rate sputtering of metallic films were systematically investigated. The depositions were performed using two unbalanced circular magnetrons of different types with a directly water-cooled planar copper target of 100 mm in diameter. The repetition frequency was 1 kHz at a fixed 20% duty cycle and an argon pressure of 0.5 Pa. Time evolutions of the discharge characteristics were measured to provide information on absorption of energy in the discharge plasma and on transfer of arising ions to the substrate at a target power density in a pulse up to 950 W/cm{sup 2}. Time-averaged mass spectroscopy was performed at the substrate position to characterize ion energy distributions and composition of total ion fluxes onto the substrate. The deposition rate of the copper films formed on a floating substrate at the distance of 100 mm from the target was 2.2 {mu}m/min at an average target power density over a pulse period of 96 W/cm{sup 2}. Very effective ionization of sputtered copper atoms resulted in a strong predominance of copper ions (up to 92%) in total ion fluxes onto the substrate. Trends in measured values of the deposition rate per average target power density and themore » ionized fraction of sputtered copper atoms in the flux onto the substrate (up to 56%) were explained on the basis of model predictions.« less

Authors:
; ; ;  [1]
  1. Department of Physics, University of West Bohemia, Univerzitni 22, 30614 Plzen (Czech Republic)
Publication Date:
OSTI Identifier:
20853949
Resource Type:
Journal Article
Resource Relation:
Journal Name: Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films; Journal Volume: 25; Journal Issue: 1; Other Information: DOI: 10.1116/1.2388954; (c) 2007 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ARGON; COPPER; COPPER IONS; DEPOSITION; HIGH-FREQUENCY DISCHARGES; MAGNETRONS; MASS SPECTROSCOPY; PLASMA CONFINEMENT; POWER DENSITY; SPUTTERING; SUBSTRATES; THIN FILMS

Citation Formats

Vlcek, Jaroslav, Kudlacek, Pavel, Burcalova, Kristyna, and Musil, Jindrich. High-power pulsed sputtering using a magnetron with enhanced plasma confinement. United States: N. p., 2007. Web. doi:10.1116/1.2388954.
Vlcek, Jaroslav, Kudlacek, Pavel, Burcalova, Kristyna, & Musil, Jindrich. High-power pulsed sputtering using a magnetron with enhanced plasma confinement. United States. doi:10.1116/1.2388954.
Vlcek, Jaroslav, Kudlacek, Pavel, Burcalova, Kristyna, and Musil, Jindrich. Mon . "High-power pulsed sputtering using a magnetron with enhanced plasma confinement". United States. doi:10.1116/1.2388954.
@article{osti_20853949,
title = {High-power pulsed sputtering using a magnetron with enhanced plasma confinement},
author = {Vlcek, Jaroslav and Kudlacek, Pavel and Burcalova, Kristyna and Musil, Jindrich},
abstractNote = {High-power pulsed dc magnetron discharges for ionized high-rate sputtering of metallic films were systematically investigated. The depositions were performed using two unbalanced circular magnetrons of different types with a directly water-cooled planar copper target of 100 mm in diameter. The repetition frequency was 1 kHz at a fixed 20% duty cycle and an argon pressure of 0.5 Pa. Time evolutions of the discharge characteristics were measured to provide information on absorption of energy in the discharge plasma and on transfer of arising ions to the substrate at a target power density in a pulse up to 950 W/cm{sup 2}. Time-averaged mass spectroscopy was performed at the substrate position to characterize ion energy distributions and composition of total ion fluxes onto the substrate. The deposition rate of the copper films formed on a floating substrate at the distance of 100 mm from the target was 2.2 {mu}m/min at an average target power density over a pulse period of 96 W/cm{sup 2}. Very effective ionization of sputtered copper atoms resulted in a strong predominance of copper ions (up to 92%) in total ion fluxes onto the substrate. Trends in measured values of the deposition rate per average target power density and the ionized fraction of sputtered copper atoms in the flux onto the substrate (up to 56%) were explained on the basis of model predictions.},
doi = {10.1116/1.2388954},
journal = {Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films},
number = 1,
volume = 25,
place = {United States},
year = {Mon Jan 15 00:00:00 EST 2007},
month = {Mon Jan 15 00:00:00 EST 2007}
}