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Title: Investigation of Bonding Generation during the Drawing of Multifilamentary Wires

Abstract

Experimental shear tests and Finite Element Modeling (FEM) have been used to study the generation of bonding during the multi-pass drawing of multifilamentary wire, focusing on the experimental conditions and materials of interest to composite superconductor manufacture. The wires were of two kinds: (1) a simple cylindrical monocore arrangement consisting of a Nb7.5%Ta core inside a Cu can (or sleeve), (2) a six-around-one restack of the monocores. For the modeling a thermo-mechanical, elasto-plastic, finite-element model was employed. Two kinds of simulations were performed: (1) the initial state of the billet was assumed to be without bonding. The FEM simulation was then performed, and from this the normal pressure, deformation, and temperature at the core/sleeve interface were calculated; (2) a pressure welding model was used to estimate the bonding stress generated at the interface by the multi-pass drawing process. On the experimental side, the Cu-clad Nb monocore 'billet' was drawn to certain size, restacked into a Cu can to form a 7 restack multifilamentary billet, and then drawn to small size. High resolution scanning electron microscopy was used to observe the characteristics of the Nb/Cu and Cu/Cu interfaces and mechanisms for the observed interfacial bonding were proposed. Furthermore, specially designed shearmore » tests were carried out to determine the interfacial shear load. The results of these led to calculations of the interfacial shear stress (i.e. the bonding stress at the interfaces), the results of which were compared with the FEM predictions in order to establish the validity of the FEM model.« less

Authors:
 [1];  [2]; ;  [3];  [4]
  1. LASM, Department of Materials Science and Engineering, Ohio State University, Columbus, OH, 43210 (United States)
  2. (United States)
  3. LASM, Department of Materials Science and Engineering, The Ohio State University, Columbus, OH, 43210 (United States)
  4. Hyper Tech Research Inc., Columbus, OH, 43212 (United States)
Publication Date:
OSTI Identifier:
20800182
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 824; Journal Issue: 1; Conference: Cryogenic engineering conference, Keystone, CO (United States), 29 Aug - 2 Sep 2005; Other Information: DOI: 10.1063/1.2192400; (c) 2006 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; 36 MATERIALS SCIENCE; BONDING; COMPUTERIZED SIMULATION; COPPER; CYLINDRICAL CONFIGURATION; DEFORMATION; DRAWING; FINITE ELEMENT METHOD; INTERFACES; NIOBIUM; RESOLUTION; SCANNING ELECTRON MICROSCOPY; SHEAR; SHEAR PROPERTIES; STRESSES; SUPERCONDUCTORS; TANTALUM; TESTING; WIRES

Citation Formats

Peng, X., Hyper Tech Research Inc., Columbus, OH, 43212, Sumption, M. D., Collings, E. W., and Tomsic, M. Investigation of Bonding Generation during the Drawing of Multifilamentary Wires. United States: N. p., 2006. Web. doi:10.1063/1.2192400.
Peng, X., Hyper Tech Research Inc., Columbus, OH, 43212, Sumption, M. D., Collings, E. W., & Tomsic, M. Investigation of Bonding Generation during the Drawing of Multifilamentary Wires. United States. doi:10.1063/1.2192400.
Peng, X., Hyper Tech Research Inc., Columbus, OH, 43212, Sumption, M. D., Collings, E. W., and Tomsic, M. Fri . "Investigation of Bonding Generation during the Drawing of Multifilamentary Wires". United States. doi:10.1063/1.2192400.
@article{osti_20800182,
title = {Investigation of Bonding Generation during the Drawing of Multifilamentary Wires},
author = {Peng, X. and Hyper Tech Research Inc., Columbus, OH, 43212 and Sumption, M. D. and Collings, E. W. and Tomsic, M.},
abstractNote = {Experimental shear tests and Finite Element Modeling (FEM) have been used to study the generation of bonding during the multi-pass drawing of multifilamentary wire, focusing on the experimental conditions and materials of interest to composite superconductor manufacture. The wires were of two kinds: (1) a simple cylindrical monocore arrangement consisting of a Nb7.5%Ta core inside a Cu can (or sleeve), (2) a six-around-one restack of the monocores. For the modeling a thermo-mechanical, elasto-plastic, finite-element model was employed. Two kinds of simulations were performed: (1) the initial state of the billet was assumed to be without bonding. The FEM simulation was then performed, and from this the normal pressure, deformation, and temperature at the core/sleeve interface were calculated; (2) a pressure welding model was used to estimate the bonding stress generated at the interface by the multi-pass drawing process. On the experimental side, the Cu-clad Nb monocore 'billet' was drawn to certain size, restacked into a Cu can to form a 7 restack multifilamentary billet, and then drawn to small size. High resolution scanning electron microscopy was used to observe the characteristics of the Nb/Cu and Cu/Cu interfaces and mechanisms for the observed interfacial bonding were proposed. Furthermore, specially designed shear tests were carried out to determine the interfacial shear load. The results of these led to calculations of the interfacial shear stress (i.e. the bonding stress at the interfaces), the results of which were compared with the FEM predictions in order to establish the validity of the FEM model.},
doi = {10.1063/1.2192400},
journal = {AIP Conference Proceedings},
number = 1,
volume = 824,
place = {United States},
year = {Fri Mar 31 00:00:00 EST 2006},
month = {Fri Mar 31 00:00:00 EST 2006}
}