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Title: X-Ray Microdiffraction as a Probe to Reveal Flux Divergences in Interconnects

Abstract

Most reliability issues in interconnect systems occur at a local scale and many of them include the local build-up of stresses. Typical failure mechanisms are electromigration and stress voiding in interconnect lines and fatigue in surface acoustic wave devices. Thus a local probe is required for the investigation of these phenomena. In this paper the application of the Laue microdiffraction technique to investigate flux divergences in interconnect systems will be described. The deviatoric strain tensor of single grains can be correlated with the local microstructure, orientation and defect density. Especially the latter led to recent results about the correlation of stress build-up and orientation in Cu lines and electromigration-induced grain rotation in Cu and Al lines.

Authors:
 [1];  [2];  [2];  [3]
  1. Lab. for Nanometallurgy, Dept. of Materials, ETH Zurich, 8093 Zurich (Switzerland)
  2. Advanced Light Source, Ernest Orlando Lawrence Berkeley National Laboratory, Berkeley, CA 94720 (United States)
  3. (United States)
Publication Date:
OSTI Identifier:
20798189
Resource Type:
Journal Article
Resource Relation:
Journal Name: AIP Conference Proceedings; Journal Volume: 817; Journal Issue: 1; Conference: 8. international workshop on stress-induced phenomena in metallization, Dresden (Germany), 12-14 Sep 2005; Other Information: DOI: 10.1063/1.2173561; (c) 2006 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; 36 MATERIALS SCIENCE; ALUMINIUM; COPPER; CORRELATIONS; DENSITY; ELECTROPHORESIS; FATIGUE; INTEGRATED CIRCUITS; MICROSTRUCTURE; ORIENTATION; RELIABILITY; ROTATION; SOUND WAVES; STRAINS; STRESSES; SURFACES; TENSORS; X-RAY DIFFRACTION

Citation Formats

Spolenak, R., Tamura, N., Patel, J. R., and Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305. X-Ray Microdiffraction as a Probe to Reveal Flux Divergences in Interconnects. United States: N. p., 2006. Web. doi:10.1063/1.2173561.
Spolenak, R., Tamura, N., Patel, J. R., & Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305. X-Ray Microdiffraction as a Probe to Reveal Flux Divergences in Interconnects. United States. doi:10.1063/1.2173561.
Spolenak, R., Tamura, N., Patel, J. R., and Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305. Tue . "X-Ray Microdiffraction as a Probe to Reveal Flux Divergences in Interconnects". United States. doi:10.1063/1.2173561.
@article{osti_20798189,
title = {X-Ray Microdiffraction as a Probe to Reveal Flux Divergences in Interconnects},
author = {Spolenak, R. and Tamura, N. and Patel, J. R. and Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305},
abstractNote = {Most reliability issues in interconnect systems occur at a local scale and many of them include the local build-up of stresses. Typical failure mechanisms are electromigration and stress voiding in interconnect lines and fatigue in surface acoustic wave devices. Thus a local probe is required for the investigation of these phenomena. In this paper the application of the Laue microdiffraction technique to investigate flux divergences in interconnect systems will be described. The deviatoric strain tensor of single grains can be correlated with the local microstructure, orientation and defect density. Especially the latter led to recent results about the correlation of stress build-up and orientation in Cu lines and electromigration-induced grain rotation in Cu and Al lines.},
doi = {10.1063/1.2173561},
journal = {AIP Conference Proceedings},
number = 1,
volume = 817,
place = {United States},
year = {Tue Feb 07 00:00:00 EST 2006},
month = {Tue Feb 07 00:00:00 EST 2006}
}
  • Most reliability issues in interconnect systems occur at a local scale and many of them include the local build-up of stresses. Typical failure mechanisms are electromigration and stress voiding in interconnect lines and fatigue in surface acoustic wave devices. Thus a local probe is required for the investigation of these phenomena. In this paper the application of the Laue microdiffraction technique to investigate flux divergences in interconnect systems will be described. The deviatoric strain tensor of single grains can be correlated with the local microstructure, orientation and defect density. Especially the latter led to recent results about the correlation ofmore » stress build-up and orientation in Cu lines and electromigration-induced grain rotation in Cu and Al lines.« less
  • We report here an in-depth synchrotron radiation based white beam X-ray microdiffraction study of plasticity in individual grains of an Al (Cu) interconnect during the early stage of electromigration. The study shows a rearrangement of the geometrically necessary dislocations (GND) in bamboo typed grains during that stage. We find that about 90percent of the GNDs are oriented so that their line direction is the closest to the current flow direction. In non-bamboo typed grains, the Laue peak positions shift, indicating that the grains rotate. An analysis in terms of force directions has been carried out and is consistent with observedmore » electromigration induced grain rotation and bending.« less
  • No abstract prepared.
  • No abstract prepared.
  • We have used x-ray microdiffraction to study the local structure and strain variation of copper interconnects. Different types of local microstructures have been found in different samples. Our data show that the Ti adhesion layer has a very dramatic effect on Cu microstructure. Strain measurement was conducted before and after electromigration test, Cu fluorescence was used to find the mass variations around voids and hillocks, and x-ray microdiffraction was used to measure the strain change around that interested region. (c) 2000 American Institute of Physics.