High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins

doi:10.1063/1.2198482

Title: High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins

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Abstract

Bulk Cu foils have been synthesized via magnetron sputtering with an average twin spacing of 5 nm. Twin interfaces are of {l_brace}111{r_brace} type and normal to the growth direction. Growth twins with such high twin density and preferred orientation have never been observed in elemental metals. These Cu foils exhibited tensile strengths of 1.2 GPa, a factor of 3 higher than that reported earlier for nanocrystalline Cu, average uniform elongation of 1%-2%, and ductile dimple fracture surfaces. This work provides a route for the synthesis of ultrahigh-strength, ductile pure metals via control of twin spacing and twin orientation in vapor-deposited materials.

Authors:

Zhang, X.; Wang, H.; Chen, X.H.; Lu, L.; Lu, K.; Hoagland, R. G.; Misra, A. ^[1]; Department of Electrical Engineering, Texas A and M University, College Station, Texas 77843-3128 ^[2]; Shenyang National Laboratory for Materials Science ^[3]; Materials Science and Technology Division, Los Alamos National Laboratory, Los Alamos, New Mexico 87545 ^[2]

Department of Mechanical Engineering, Texas A and M University, College Station, Texas 77843-3123 (United States)
(United States)
(SYNL), Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China)

Publication Date:: Mon Apr 24 00:00:00 EDT 2006

OSTI Identifier:: 20779183

Resource Type:: Journal Article

Resource Relation:: Journal Name: Applied Physics Letters; Journal Volume: 88; Journal Issue: 17; Other Information: DOI: 10.1063/1.2198482; (c) 2006 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA)

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE; COPPER; CRYSTAL GROWTH; CRYSTALS; DENSITY; DEPOSITION; DUCTILITY; ELONGATION; FOILS; FRACTURES; GRAIN ORIENTATION; INTERFACES; NANOSTRUCTURES; PRESSURE RANGE GIGA PA; SPUTTERING; TEXTURE; THIN FILMS; TWINNING; VAPOR DEPOSITED COATINGS

Citation Formats


                    Zhang, X., Wang, H., Chen, X.H., Lu, L., Lu, K., Hoagland, R. G., Misra, A., Department of Electrical Engineering, Texas A and M University, College Station, Texas 77843-3128, Shenyang National Laboratory for Materials Science, and Materials Science and Technology Division, Los Alamos National Laboratory, Los Alamos, New Mexico 87545. High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins.  United States: N. p., 2006. 
        Web.  doi:10.1063/1.2198482.

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                    Zhang, X., Wang, H., Chen, X.H., Lu, L., Lu, K., Hoagland, R. G., Misra, A., Department of Electrical Engineering, Texas A and M University, College Station, Texas 77843-3128, Shenyang National Laboratory for Materials Science, & Materials Science and Technology Division, Los Alamos National Laboratory, Los Alamos, New Mexico 87545. High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins.  United States.  doi:10.1063/1.2198482.

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                    Zhang, X., Wang, H., Chen, X.H., Lu, L., Lu, K., Hoagland, R. G., Misra, A., Department of Electrical Engineering, Texas A and M University, College Station, Texas 77843-3128, Shenyang National Laboratory for Materials Science, and Materials Science and Technology Division, Los Alamos National Laboratory, Los Alamos, New Mexico 87545. Mon .  
        "High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins".  United States.  
        doi:10.1063/1.2198482.

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@article{osti_20779183,

  title        = {High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins},

  author       = {Zhang, X. and Wang, H. and Chen, X.H. and Lu, L. and Lu, K. and Hoagland, R. G. and Misra, A. and Department of Electrical Engineering, Texas A and M University, College Station, Texas 77843-3128 and Shenyang National Laboratory for Materials Science and Materials Science and Technology Division, Los Alamos National Laboratory, Los Alamos, New Mexico 87545},

  abstractNote = {Bulk Cu foils have been synthesized via magnetron sputtering with an average twin spacing of 5 nm. Twin interfaces are of {l_brace}111{r_brace} type and normal to the growth direction. Growth twins with such high twin density and preferred orientation have never been observed in elemental metals. These Cu foils exhibited tensile strengths of 1.2 GPa, a factor of 3 higher than that reported earlier for nanocrystalline Cu, average uniform elongation of 1%-2%, and ductile dimple fracture surfaces. This work provides a route for the synthesis of ultrahigh-strength, ductile pure metals via control of twin spacing and twin orientation in vapor-deposited materials.},

  doi          = {10.1063/1.2198482},

  journal      = {Applied Physics Letters},

  number       = 17,

  volume       = 88,

  place        = {United States},

  year         = {Mon Apr 24 00:00:00 EDT 2006},

  month        = {Mon Apr 24 00:00:00 EDT 2006}

}

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DOI: 10.1063/1.2198482

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