Quantitative analysis of sputter processes in a small magnetron system

Journal Article · Tue Nov 15 00:00:00 EST 2005 · Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films

DOI:https://doi.org/10.1116/1.2091197· OSTI ID:20723216

Knittel, Ivo; Gothe, Marc; Hartmann, Uwe ^[1]

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1. Institute of Experimental Physics, University of Saarbruecken, P. O. Box 151150, 66041 Saarbruecken (Germany)

Sputter deposition of titanium in argon from a small circular magnetron is characterized. The dependence of the deposition rate on pressure, power, and target-substrate distance has been measured. A framework for the application of the analytic approach by Keller and Simmons of ballistic and diffusive transport to simple three-dimensional sputter geometries is developed and applied. The sputter yield and the pressure-distance product are determined from the data set as the only fit parameters of the model. For the entire range of operation of the magnetron, the sputter process can be described in terms of the relatively simple approach.

• OSTI ID: 20723216
• Journal Information: Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films, Vol. 23, Issue 6; Other Information: DOI: 10.1116/1.2091197; (c) 2005 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA); ISSN 0734-2101
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ARGON
DIFFUSION
ENERGY DEPENDENCE
MAGNETRONS
PRESSURE DEPENDENCE
SPACE DEPENDENCE
SPUTTERING
SUBSTRATES
SURFACE COATING
THIN FILMS
TITANIUM