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Title: Large tunnel magnetoresistance at room temperature with a Co{sub 2}FeAl full-Heusler alloy electrode

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.1944893· OSTI ID:20702445
; ; ; ;  [1]
  1. Department of Materials Science, Graduate School of Engineering, Tohoku University, Aoba-yama 6-6-02, Sendai 980-8579 (Japan)

Magnetic tunnel junctions (MTJs) with a Co{sub 2}FeAl Heusler alloy electrode are fabricated by the deposition of the film using an ultrahigh vacuum sputtering system followed by photolithography and Ar ion etching. A tunnel magnetoresistance (TMR) of 47% at room temperature (RT) are obtained in a stack of Co{sub 2}FeAl/Al-O{sub x}/Co{sub 75}Fe{sub 25} magnetic tunnel junction (MTJ) fabricated on a thermally oxidized Si substrate despite the A2 type atomic site disorder for Co{sub 2}FeAl. There is no increase of TMR in MTJs with the B2 type Co{sub 2}FeAl, which is prepared by the deposition on a heated substrate. X-ray photoelectron spectroscopy (XPS) depth profiles in Co{sub 2}FeAl single layer films reveal that Al atoms in Co{sub 2}FeAl are oxidized preferentially at the surfaces. On the other hand, at the interfaces in Co{sub 2}FeAl/Al-O{sub x}/Co{sub 75}Fe{sub 25} MTJs, the ferromagnetic layers are hardly oxidized during plasma oxidation for a formation of Al oxide barriers.

OSTI ID:
20702445
Journal Information:
Applied Physics Letters, Vol. 86, Issue 23; Other Information: DOI: 10.1063/1.1944893; (c) 2005 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English