System performance modeling of extreme ultraviolet lithographic thermal issues

Journal Article · Mon Nov 01 00:00:00 EST 1999 · Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena

DOI:https://doi.org/10.1116/1.590949· OSTI ID:20217906

Spence, P A ^[1]; Gianoulakis, S E ^[1]; Moen, C D ^[1]; Kanouff, M P ^[1]; Fisher, A ^[1]; Ray-Chaudhuri, A K ^[1]

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1. Sandia National Laboratories, Livermore, California 94551 (United States)

Numerical simulation is used in the development of an extreme ultraviolet lithography Engineering Test Stand. Extensive modeling was applied to predict the impact of thermal loads on key lithographic parameters such as image placement error, focal shift, and loss of CD control. We show that thermal issues can be effectively managed to ensure that their impact on lithographic performance is maintained within design error budgets. (c) 1999 American Vacuum Society.

• OSTI ID: 20217906
• Journal Information: Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena, Vol. 17, Issue 6; Other Information: PBD: Nov 1999; ISSN 0734-211X
• Country of Publication: United States
• Language: English

Related Subjects

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY
OPTICAL SYSTEMS
EXTREME ULTRAVIOLET RADIATION
SIMULATION
NUMERICAL SOLUTION
ERRORS
HEATING
LAYERS
DESIGN
THERMAL EXPANSION
INTEGRATED CIRCUITS