Molecular-dynamics study of the mechanism and kinetics of void growth in ductile metallic thin films

Journal Article · Mon Jul 17 00:00:00 EDT 2000 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.126971· OSTI ID:20217002

Gungor, M Rauf ^[1]; Maroudas, Dimitrios ^[1]; Zhou, Shujia ^[2]

---

1. Department of Chemical Engineering, University of California, Santa Barbara, California 93106-5080 (United States)
2. Applied Theoretical and Computational Physics Division, Los Alamos National Laboratory, Los Alamos, New Mexico 87545 (United States)

A molecular-dynamics study is presented of the mechanism and kinetics of void growth and morphological evolution in ductile metallic thin films subject to biaxial tensile strains. The void becomes faceted, grows, and relieves strain by emission from its surface of pairs of screw dislocations with opposite Burgers vectors. Repeated dislocation generation and propagation leads to formation of a step pattern on the film's surfaces. A simple phenomenological kinetic model of void growth is derived. Such kinetic equations can be used to formulate constitutive theories of plastic deformation for continuum-scale modeling of void evolution. (c) 2000 American Institute of Physics.

• OSTI ID: 20217002
• Journal Information: Applied Physics Letters, Vol. 77, Issue 3; Other Information: PBD: 17 Jul 2000; ISSN 0003-6951
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COPPER
VOIDS
MICROSTRUCTURE
THIN FILMS
MOLECULAR DYNAMICS METHOD
SIMULATION
STRAINS
SCREW DISLOCATIONS
PLASTICITY
THEORETICAL DATA