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Title: Processing and device performance of GaN power rectifiers

Conference ·
OSTI ID:20104630

Mesa and planar geometry GaN Schottky rectifiers were fabricated on 3--12 {micro}m thick epitaxial layers. In planar diodes utilizing resistive GaN, a reverse breakdown voltage of 3.1 kV was achieved in structures containing p-guard rings and employing extension of the Schottky contact edge over an oxide layer. In devices without edge termination, the reverse breakdown voltage was 2.3 kV. Mesa diodes fabricated on conducting GaN had breakdown voltages in the range 200--400 V, with on-state resistances as low as 6m {Omega}{center_dot}cm{sup {minus}2}.

Research Organization:
Univ. of Florida, Gainesville, FL (US)
OSTI ID:
20104630
Resource Relation:
Conference: 1999 Materials Research Society Fall Meeting, Boston, MA (US), 11/28/1999--12/03/1999; Other Information: PBD: 2000; Related Information: In: GaN and related alloys -- 1999. Materials Research Society symposium proceedings, Volume 595, by Myers, T.H.; Feenstra, R.M.; Shur, M.S.; Amano, Hiroshi [eds.], [1050] pages.
Country of Publication:
United States
Language:
English

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