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Title: Laminated photovoltaic modules using back-contact solar cells

Abstract

Photovoltaic modules which comprise back-contact solar cells, such as back-contact crystalline silicon solar cells, positioned atop electrically conductive circuit elements affixed to a planar support so that a circuit capable of generating electric power is created. The modules are encapsulated using encapsulant materials such as EVA which are commonly used in photovoltaic module manufacture. The module designs allow multiple cells to be electrically connected in a single encapsulation step rather than by sequential soldering which characterizes the currently used commercial practices.

Authors:
; ; ;
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
20014149
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 14 Sep 1999
Country of Publication:
United States
Language:
English
Subject:
14 SOLAR ENERGY; BACK CONTACT SOLAR CELLS; SILICON SOLAR CELLS; SOLAR CELL ARRAYS; FABRICATION

Citation Formats

Gee, J M, Garrett, S E, Morgan, W P, and Worobey, W. Laminated photovoltaic modules using back-contact solar cells. United States: N. p., 1999. Web.
Gee, J M, Garrett, S E, Morgan, W P, & Worobey, W. Laminated photovoltaic modules using back-contact solar cells. United States.
Gee, J M, Garrett, S E, Morgan, W P, and Worobey, W. 1999. "Laminated photovoltaic modules using back-contact solar cells". United States.
@article{osti_20014149,
title = {Laminated photovoltaic modules using back-contact solar cells},
author = {Gee, J M and Garrett, S E and Morgan, W P and Worobey, W},
abstractNote = {Photovoltaic modules which comprise back-contact solar cells, such as back-contact crystalline silicon solar cells, positioned atop electrically conductive circuit elements affixed to a planar support so that a circuit capable of generating electric power is created. The modules are encapsulated using encapsulant materials such as EVA which are commonly used in photovoltaic module manufacture. The module designs allow multiple cells to be electrically connected in a single encapsulation step rather than by sequential soldering which characterizes the currently used commercial practices.},
doi = {},
url = {https://www.osti.gov/biblio/20014149}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Sep 14 00:00:00 EDT 1999},
month = {Tue Sep 14 00:00:00 EDT 1999}
}