High thermal expansion sealing glass for use in radio frequency applications
The present invention provides a glass composition for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, and copper alloys, which includes between about 10 and about 25 mole percent Na{sub 2}O, between about 10 and about 25 mole percent K{sub 2}O, between about 4 and about 15 mole percent Al{sub 2}O{sub 3}, between about 35 and about 50 mole percent P{sub 2}O{sub 5}, B{sub 2}O{sub 3} in a concentration not exceeding 10 mole percent, and MXO in a concentration not exceeding 12 mole percent, wherein MXO is a metal oxide selected from the group consisting of PbO, BaO, CaO and MgO or a mixture thereof. This composition is suitable to hermetically seal to components for use in RF-interconnection applications.
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 20013802
- Resource Relation:
- Other Information: PBD: 12 Oct 1999
- Country of Publication:
- United States
- Language:
- English
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High thermal expansion, sealing glass
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