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Title: High thermal expansion sealing glass for use in radio frequency applications

Abstract

The present invention provides a glass composition for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, and copper alloys, which includes between about 10 and about 25 mole percent Na{sub 2}O, between about 10 and about 25 mole percent K{sub 2}O, between about 4 and about 15 mole percent Al{sub 2}O{sub 3}, between about 35 and about 50 mole percent P{sub 2}O{sub 5}, B{sub 2}O{sub 3} in a concentration not exceeding 10 mole percent, and MXO in a concentration not exceeding 12 mole percent, wherein MXO is a metal oxide selected from the group consisting of PbO, BaO, CaO and MgO or a mixture thereof. This composition is suitable to hermetically seal to components for use in RF-interconnection applications.

Authors:
; ;
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
20013802
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 12 Oct 1999
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING; GLASS; SEALING MATERIALS; THERMAL EXPANSION; CHEMICAL COMPOSITION; SODIUM OXIDES; POTASSIUM OXIDES; ALUMINIUM OXIDES; PHOSPHORUS OXIDES; BORON OXIDES; RF SYSTEMS

Citation Formats

Kilgo, R D, Brow, R K, and Kovacic, L. High thermal expansion sealing glass for use in radio frequency applications. United States: N. p., 1999. Web.
Kilgo, R D, Brow, R K, & Kovacic, L. High thermal expansion sealing glass for use in radio frequency applications. United States.
Kilgo, R D, Brow, R K, and Kovacic, L. 1999. "High thermal expansion sealing glass for use in radio frequency applications". United States.
@article{osti_20013802,
title = {High thermal expansion sealing glass for use in radio frequency applications},
author = {Kilgo, R D and Brow, R K and Kovacic, L},
abstractNote = {The present invention provides a glass composition for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, and copper alloys, which includes between about 10 and about 25 mole percent Na{sub 2}O, between about 10 and about 25 mole percent K{sub 2}O, between about 4 and about 15 mole percent Al{sub 2}O{sub 3}, between about 35 and about 50 mole percent P{sub 2}O{sub 5}, B{sub 2}O{sub 3} in a concentration not exceeding 10 mole percent, and MXO in a concentration not exceeding 12 mole percent, wherein MXO is a metal oxide selected from the group consisting of PbO, BaO, CaO and MgO or a mixture thereof. This composition is suitable to hermetically seal to components for use in RF-interconnection applications.},
doi = {},
url = {https://www.osti.gov/biblio/20013802}, journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {10}
}