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Title: High thermal expansion sealing glass for use in radio frequency applications

Patent ·
OSTI ID:20013802

The present invention provides a glass composition for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, and copper alloys, which includes between about 10 and about 25 mole percent Na{sub 2}O, between about 10 and about 25 mole percent K{sub 2}O, between about 4 and about 15 mole percent Al{sub 2}O{sub 3}, between about 35 and about 50 mole percent P{sub 2}O{sub 5}, B{sub 2}O{sub 3} in a concentration not exceeding 10 mole percent, and MXO in a concentration not exceeding 12 mole percent, wherein MXO is a metal oxide selected from the group consisting of PbO, BaO, CaO and MgO or a mixture thereof. This composition is suitable to hermetically seal to components for use in RF-interconnection applications.

Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
OSTI ID:
20013802
Resource Relation:
Other Information: PBD: 12 Oct 1999
Country of Publication:
United States
Language:
English