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Title: Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu{sub 6}Sn{sub 5} reinforcements

Abstract

Solidification of eutectic Sn-Ag solder, with and without Cu{sub 6}Sn{sub 5} composite reinforcements, on copper substrates, was investigated at two different cooling rates. The size, orientation, randomness, and overall morphology of the dendritic microstructure were examined as a function of cooling rate. Cu{sub 6}Sn{sub 5} particle reinforcements were found to act as nucleation sites for dendrites, in addition to sites on the substrate/solder interface. The mechanical properties of these solders were also examined as a function of cooling rate. Solder joints with a lower load-carrying area were found to exhibit higher shear strength, but reduced ductility when compared to solder joints with more load carrying area.

Authors:
; ; ; ;
Publication Date:
Research Org.:
Michigan State Univ., East Lansing, MI (US)
OSTI Identifier:
20001749
Resource Type:
Journal Article
Journal Name:
Journal of Electronic Materials
Additional Journal Information:
Journal Volume: 28; Journal Issue: 11; Conference: InterconnectPACK: Interconnections for Electronic Packaging, San Diego, CA (US), 02/28/1999--03/04/1999; Other Information: PBD: Nov 1999
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; MICROSTRUCTURE; MECHANICAL PROPERTIES; TIN ALLOYS; SILVER ALLOYS; COPPER ADDITIONS; SOLDERED JOINTS; INTERMETALLIC COMPOUNDS; EUTECTICS; DENDRITES; COOLING

Citation Formats

Sigelko, J, Choi, S, Subramanian, K N, Lucas, J P, and Bieler, T R. Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu{sub 6}Sn{sub 5} reinforcements. United States: N. p., 1999. Web. doi:10.1007/s11664-999-0155-2.
Sigelko, J, Choi, S, Subramanian, K N, Lucas, J P, & Bieler, T R. Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu{sub 6}Sn{sub 5} reinforcements. United States. doi:10.1007/s11664-999-0155-2.
Sigelko, J, Choi, S, Subramanian, K N, Lucas, J P, and Bieler, T R. Mon . "Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu{sub 6}Sn{sub 5} reinforcements". United States. doi:10.1007/s11664-999-0155-2.
@article{osti_20001749,
title = {Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu{sub 6}Sn{sub 5} reinforcements},
author = {Sigelko, J and Choi, S and Subramanian, K N and Lucas, J P and Bieler, T R},
abstractNote = {Solidification of eutectic Sn-Ag solder, with and without Cu{sub 6}Sn{sub 5} composite reinforcements, on copper substrates, was investigated at two different cooling rates. The size, orientation, randomness, and overall morphology of the dendritic microstructure were examined as a function of cooling rate. Cu{sub 6}Sn{sub 5} particle reinforcements were found to act as nucleation sites for dendrites, in addition to sites on the substrate/solder interface. The mechanical properties of these solders were also examined as a function of cooling rate. Solder joints with a lower load-carrying area were found to exhibit higher shear strength, but reduced ductility when compared to solder joints with more load carrying area.},
doi = {10.1007/s11664-999-0155-2},
journal = {Journal of Electronic Materials},
number = 11,
volume = 28,
place = {United States},
year = {1999},
month = {11}
}